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Temperature metrology: Low and ultra-low temperatures

Proceedings of the International School of Physics “Enrico Fermi”
1. Introduction; 2. Refrigeration and thermometry; 3. Secondary thermometers; 4. The unit of thermodynamic temperature; 5. The measurement of thermodynamic temperature; 5.1. Gas thermometry; 5.2. Acoustic gas thermometry; 5.3. Other thermodynamic techniques; 6. International Temperature Scale of 1990, ITS-90; 6.1.
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Magnetic Susceptibility Measurements at Ultra-low Temperatures

Journal of Low Temperature Physics, 2009
We report the design and operation of a device for ac magnetic susceptibility measurements that can operate down to 1 mK. The device, a modification of the standard mutual inductance bridge, is designed with detailed consideration of the thermalization and optimization of each element.
L. Yin   +4 more
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Condensed matter physics at ultra-low temperatures

AIP Conference Proceedings, 2012
Studying materials at micro-Kelvin (μK) temperatures helps us discover their true ground states and this has great implications in understanding their properties at higher temperatures. The thermal fluctuations would die down at these temperatures and are not present at absolute zero.
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Greene Tweed develops ultra-low-temperature elastomer

Sealing Technology, 2019
Greene Tweed & Co – a manufacturer of high-performance seals and engineered components – has developed an ultra-low-temperature and chemical-resistant elastomer, specifically formulated to meet and exceed the requirements of AMS 7379 and AMS-P-83461 aerospace material specifications (AMS).
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Ultra low temperature cryogen free refrigerator

1997
Details of a compact ultra low magnetic field adiabatic demagnetization refrigerator which is under development are presented. The appropriate choice of refrigerants has enabled a factor >5 reduction in the required magnetic field, leading to significant savings in size, mass, thermal load and recycle time.
Bromiley, P. A.   +2 more
openaire   +1 more source

Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
3D integration is increasingly gaining interest for a wide range of applications including CMOS Image Sensor, DRAM and High Performance Computing. Image sensors based on hybrid bonding 3D integration are the state-of-the-art in imaging applications. Low temperature hybrid bonding (< 300 °C) is more and more demanded by the industry to reduce the ...
Margot Faure   +8 more
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Ultra Low Temperature NiSi Processing

2005 13th International Conference on Advanced Thermal Processing of Semiconductors, 2006
A. Hunter   +8 more
openaire   +1 more source

Ultra-high temperature ceramics for extreme environments

Nature Reviews Materials, 2023
Elizabeth
exaly  

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