Results 51 to 60 of about 20,778 (247)
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source
This study focuses on common batteries used in electric vehicles, which are composed of cells grouped into modules and stacked to form a battery pack. Ultrasonic metal welding (UMW) is employed to bond these cells, and ensuring a reliable weld quality by
Hyojun Choi +6 more
doaj +1 more source
Novel Functional Materials via 3D Printing by Vat Photopolymerization
This Perspective systematically analyzes strategies for incorporating functionalities into 3D‐printed materials via Vat Photopolymerization (VP). It explores the spectrum of achievable functionalities in recently reported novel materials—such as conductive, energy‐storing, biodegradable, stimuli‐responsive, self‐healing, shape‐memory, biomaterials, and
Sergey S. Nechausov +3 more
wiley +1 more source
s‐Orbital Mediated Metavalent Bonding Enables State‐Of‐The‐Art n‐Type AgBiSe2 Thermoelectrics
Metavalent bonding (MVB) underpins the exceptional property portfolio of chalcogenides. Typical MVB solids are mainly found in p‐bonded systems. This work reveals that MVB can also be formed with s‐p orbital interactions upon forming a single‐electron σ‐bond, as exemplified in AgBiSe2.
Binrong Huang +13 more
wiley +1 more source
In order to refine microstructures, enhance corrosion resistance and mechanical properties of Ti/Mg joints, the ultrasonic vibration assistance (UVA) treatment were applied during the welding-brazing of Ti/Mg dissimilar metal.
Chuan Xu, Xinjian Yuan
doaj +1 more source
Auxeticity‑by‑Assembly converts freeform photovoltaics from cut‑defined layouts to assembly‑defined systems. Standardized interlocking units generate negative‑Poisson‑ratio, reconfigurable architectures, while hinge regions are wired by selectively activatable AgNW–GO@EGaIn composite interconnects and a folding‑enabled interconnector layer. A decimeter‑
Seok Joon Hwang +15 more
wiley +1 more source
The ultrasonic spinning with welding method is a novel approach combining mechanical force field and ultrasonic energy field to control welding deformation of thin-walled components during welding. Its core lies in applying ultrasonic spinning within the
Xinghong JI +5 more
doaj +1 more source
Study on the bonding mechanism of multilayer copper with nickel sheet in ultrasonic welding process
The metal-plastic flow and bonding strength of three-layer copper (Cu) with single-layer nickel (Ni) joints via ultrasonic welding were investigated in this study.
Fuxing Ye +3 more
doaj +1 more source
Maximum Height to Width Ratio of Freestanding Structures Built Using Ultrasonic Consolidation [PDF]
Ultrasonic consolidation (UC) is a process whereby metal foils can be metallurgically bonded at or near room temperature. The UC process works by inducing high-speed differential motion (~20kHz) between a newly deposited layer and a substrate (which ...
Janaki Ram, G. D. +5 more
core +1 more source
Percutaneous prosthetic venous valves are fabricated by embedding stents in an electrospun matrix that extends luminally to form leaflets. The design shields leaflets from hyperplastic cells, isolates struts from blood contact, and avoids discrete anchoring points.
Dario Arcuti +6 more
wiley +1 more source

