Results 231 to 240 of about 1,213,467 (327)

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley   +1 more source

Roadmap to Precision 3D Printing of Cellulose: Rheology‐Guided Formulation, Fidelity Assessment, and Application Horizons

open access: yesAdvanced Materials Technologies, EarlyView.
This critical review presents a comprehensive roadmap for the precision 3D printing of cellulose. Quantitative correlations link ink formulation and rheological properties to print fidelity and final material performance. This framework guides the development of advanced functional materials, from biomedical scaffolds to electromagnetic shielding ...
Majed Amini   +3 more
wiley   +1 more source

Printed 2.5D‐Microstructures with Material‐Specific Functionalization for Tunable Biosensing

open access: yesAdvanced Materials Technologies, EarlyView.
The 2.5D‐MiSENSE platform integrates a microstructured biosensor with an in‐line milking pipeline to enable real‐time detection of mastitis biomarkers during active milk flow. The system uses a 2.5D microengineered surface and patterned electrodes to enhance milk–sensor interaction.
Matin Ataei Kachouei   +2 more
wiley   +1 more source

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