Results 221 to 230 of about 27,730 (323)

A Hierarchically Structured, Stretchable, Anti‐Biofouling Encapsulation for Biodegradable Electronics

open access: yesAdvanced Healthcare Materials, EarlyView.
A soft, stretchable, anti‐biofouling encapsulant is developed by integrating organosilicon nanowire networks with microstructured biodegradable elastomers. The hierarchical surface exhibits superhydrophobicity and enhances water barrier properties by 420% over pristine polymers, while preserving mechanical integrity.
Won Bae Han   +7 more
wiley   +1 more source

A Review of Image Enhancement Techniques for Underwater Images

open access: yesBioscience Biotechnology Research Communications, 2020
openaire   +1 more source

Fatigue‐Resistant Mechanoresponsive Color‐Changing Hydrogels for Vision‐Based Tactile Robots

open access: yesAdvanced Materials, EarlyView.
Mechanoresponsive color‐changing materials that can reversibly and resiliently change color in response to stress are highly desirable for diverse technologies in optics, sensors, and robots; however, such materials are rarely achieved. This work reports a fatigue‐resistant mechanoresponsive color‐changing hydrogel that exhibits reversible, resilient ...
Jiabin Liu   +4 more
wiley   +1 more source

UWFormer: Underwater Image Enhancement via a Semi-Supervised Multi-Scale Transformer

open access: green, 2023
Xuhang Chen   +5 more
openalex   +2 more sources

Thermal Processing Creates Water‐Stable PEDOT:PSS Films for Bioelectronics

open access: yesAdvanced Materials, Volume 37, Issue 13, April 2, 2025.
Instead of using chemical cross–linkers, it is shown that PEDOT:PSS thin films for bioelectronics become water‐stable after a simple heat treatment. The heat treatment is compatible with a range of rigid and elastomeric substrates and films are stable in vivo for >20 days.
Siddharth Doshi   +16 more
wiley   +1 more source

Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration

open access: yesAdvanced Materials, EarlyView.
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa   +9 more
wiley   +1 more source

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