A soft, stretchable, anti‐biofouling encapsulant is developed by integrating organosilicon nanowire networks with microstructured biodegradable elastomers. The hierarchical surface exhibits superhydrophobicity and enhances water barrier properties by 420% over pristine polymers, while preserving mechanical integrity.
Won Bae Han +7 more
wiley +1 more source
Toward Sufficient Spatial-Frequency Interaction for Gradient-aware Underwater Image Enhancement
Chen Zhao +3 more
openalex +2 more sources
Optimized UNet framework with a joint loss function for underwater image enhancement. [PDF]
Wang X, Luo Z, Huang W, Zhang Y, Hu R.
europepmc +1 more source
A Review of Image Enhancement Techniques for Underwater Images
openaire +1 more source
Fatigue‐Resistant Mechanoresponsive Color‐Changing Hydrogels for Vision‐Based Tactile Robots
Mechanoresponsive color‐changing materials that can reversibly and resiliently change color in response to stress are highly desirable for diverse technologies in optics, sensors, and robots; however, such materials are rarely achieved. This work reports a fatigue‐resistant mechanoresponsive color‐changing hydrogel that exhibits reversible, resilient ...
Jiabin Liu +4 more
wiley +1 more source
UWFormer: Underwater Image Enhancement via a Semi-Supervised Multi-Scale Transformer
Xuhang Chen +5 more
openalex +2 more sources
MHF: A multi-task hybrid fusion method for underwater image enhancement based on biological vision. [PDF]
Chi Y, Zhang C.
europepmc +1 more source
Thermal Processing Creates Water‐Stable PEDOT:PSS Films for Bioelectronics
Instead of using chemical cross–linkers, it is shown that PEDOT:PSS thin films for bioelectronics become water‐stable after a simple heat treatment. The heat treatment is compatible with a range of rigid and elastomeric substrates and films are stable in vivo for >20 days.
Siddharth Doshi +16 more
wiley +1 more source
WEDM: Wavelet-Enhanced Diffusion with Multi-Stage Frequency Learning for Underwater Image Enhancement. [PDF]
Chen J, Ye S, Ouyang X, Zhuang J.
europepmc +1 more source
Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa +9 more
wiley +1 more source

