Results 161 to 170 of about 59,883 (284)

Advances in Solid‐Phase Processing Techniques: Innovations, Applications, and Future Perspectives

Advanced Materials Technologies, EarlyView.
Based on practical manufacturing challenges, this review examines advanced solid‐phase processing techniques that overcome the inherent limitations of conventional melting‐based and traditional solid‐phase manufacturing, enabling the production of higher‐performance components at reduced cost through process innovation and improved supply‐chain ...
Tianhao Wang
wiley   +1 more source

Integrating simplified Swin-T with modified EFS-Net for attention-guided underwater pipelines segmentation in complex underwater environments. [PDF]

Sci Rep
Hosseini N, Mohanna F, Moghimi MK.
europepmc   +1 more source

Degradation Mechanisms in PEM Water Electrolysis: Diagnosis and Impact

Advanced Materials Technologies, EarlyView.
This review provides an analysis of degradation mechanisms in proton electrolyte membrane water electrolyzers (PEMWE), focusing on all key components. It discusses diagnostic and measurement techniques for evaluating degradation, less‐studied mechanisms, and an expert survey.
Annik Bernhardt, Katja Lange, Robert Göckeritz, Erik Grunwald, Angelika Hähnel, Alexander Müller, Volker Naumann, Sistan Rasuli, Wolfram Münchgesang, Bruno G. Pollet, Kerstin Witte‐Bodnar, Klemens Ilse   +11 more
wiley   +1 more source

DFSE-YOLO: deep feature selective enhancement for efficient shipwreck detection in side-scan sonar imagery. [PDF]

Sci Rep
Lin Y, Song L, Feng Q, He S, Huang N, Zhu Y.   +5 more
europepmc   +1 more source

Molecular Inks for the Development of Complex 3D In‐Mold Electronics

Advanced Materials Technologies, EarlyView.
Molecular inks (MINKs) enable the fabrication of thermoformed 3D circuits by decoupling the forming and metallization steps. Following thermoforming, intense pulsed‑light or thermal processing converts the patterned MINKs into complex 3D conductive tracks with improved stretchability and electrical performance, advancing low‑cost, high‑performance in ...
Mehal P. Kushalkar, Hiroshi Fukutani, Olga Mozenson, Jianying Ouyang, Liliana Gaburici, Bhavana Deore, Dayna Bennett, Chantal Paquet, Paul Trudeau, Loleï Khoun, Nicolas Milliken, Olivier Ferrand, Julie Ferrigno, Xiangyang Liu, Arnold J. Kell   +14 more
wiley   +1 more source

A Deep Feature Fusion Underwater Image Enhancement Model Based on Perceptual Vision Swin Transformer. [PDF]

J Imaging
Tian S, Sirikham A, Konpang J, Wang C.
europepmc   +1 more source

Hydrogel‐Based Functional Materials: Classifications, Properties, and Applications

Advanced Materials Technologies, EarlyView.
Conductive hydrogels have emerged as promising materials for smart wearable devices due to their outstanding flexibility, multifunctionality, and biocompatibility. This review systematically summarizes recent progress in their design strategies, focusing on monomer systems and conductive components, and highlights key multifunctional properties such as
Zeyu Zhang, Zao Cheng, Patrizio Raffa
wiley   +1 more source

Energy-Efficient and Adversarially Resilient Underwater Object Detection via Adaptive Vision Transformers. [PDF]

Sensors (Basel)
Li L, Zhang G, Zhou Y.
europepmc   +1 more source

Degradable Donor‐Acceptor Polymeric Mixed Ionic‐Electronic Conductors for Transient Electronics

Advanced Materials Technologies, EarlyView.
Here, we report degradable donor–acceptor (D–A) polymeric mixed ionic‐electronic conductors for transient electronics. We take a systematic side chain engineering approach to elucidate how molecular‐level modifications of donor–acceptor (D–A) polymer structures can satisfy demands that are often conflicting: degradability, charge carrier transport, and
Angela Lin, Zhichang Liu, Saroj Upreti, Stanley Lo, Nathan Sung Yuan Hsu, Xiaodan Gu, Sihong Wang, Helen Tran   +7 more
wiley   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

Advanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco, Nicola Larovere, Antonio Zagaria, Antonio Pavone, Rosanna Rifino, Gianni Stano   +5 more
wiley   +1 more source