Results 221 to 230 of about 31,451 (307)

Anti‐Slip Material‐Based Strategies and Approaches

open access: yesAdvanced Materials Technologies, EarlyView.
This review highlights the principle mechanisms of slipping at the microscale, linking contact mechanics with a friction behavior model for surface interfaces. Main strategies to develop anti‐slip properties to the surfaces are discussed alongside standardized testing approaches.
Sogand Abbaspoor‐Zanjani   +3 more
wiley   +1 more source

End‐to‐End Sensing Systems for Breast Cancer: From Wearables for Early Detection to Lab‐Based Diagnosis Chips

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores advances in wearable and lab‐on‐chip technologies for breast cancer detection. Covering tactile, thermal, ultrasound, microwave, electrical impedance tomography, electrochemical, microelectromechanical, and optical systems, it highlights innovations in flexible electronics, nanomaterials, and machine learning.
Neshika Wijewardhane   +4 more
wiley   +1 more source

The Effect of Dimethyl Sulfoxide on the Microtensile Bond Strength of Universal Adhesives to Dentin. [PDF]

open access: yesFront Dent
Dadvar Z   +4 more
europepmc   +1 more source

Light-Switchable Polymer Adhesive Based on Photoinduced Reversible Solid-to-Liquid Transitions [PDF]

open access: yes, 2019
Ban, Q.   +8 more
core   +1 more source

Large‐Scale and Cost‐Effective Fabrication of Ultra‐Thin, Biodegradable Microelectrode Arrays and Pressure Sensors Using Laser Micromachining

open access: yesAdvanced Materials Technologies, EarlyView.
A mask‐free and cost‐effective UV‐pico‐second laser‐based microfabrication method is proposed to fabricate large‐area biodegradable microelectrode arrays and pressure sensors. These devices demonstrate low impedance, good conformability, excellent biocompatibility, and rapid degradation, providing a new route for next‐generation transient electronics ...
Bhavani Prasad Yalagala   +5 more
wiley   +1 more source

Characterization and Design Framework for Micro‐ and Nanoscale Printed Metal Interconnects in Hybrid Electronic Systems

open access: yesAdvanced Materials Technologies, EarlyView.
This work establishes a framework for high‐resolution printed interconnects by coupling e‐jet printing control, multilayer deposition, and sintering optimization. Ink properties and printing speed influence particle stacking, while different sintering atmospheres drive distinct microstructural evolution.
Kaifan Yue   +6 more
wiley   +1 more source

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