Results 151 to 160 of about 715,050 (330)
Laser remelting of a CrMnFeCoNi high‐entropy alloy reveals that optimal chemical homogenization occurs between 30 and 40 J·mm−2. Within this range, elemental segregation is reduced by over 30% compared to the as‐cast state. The study establishes this window as a fast, effective alternative to prolonged annealing for achieving uniform elemental ...
Ajay Talbot+5 more
wiley +1 more source
Identifying Influential Theories in Human-Computer Interaction Within Health Informatics: A Systematic Review. [PDF]
Mohammadzadeh N, Lotfi F, Samadpour H.
europepmc +1 more source
Evaluation of User Interface of Computer Application Developed for Screening Pediatric Asthma
Maryam Zolnoori+5 more
openalex +1 more source
The dielectric elastomer‐based electropneumatic device (DE‐EPD) is a vacuum‐assisted ventricular assist device (VAD) that delivers high performance (85 mmHg, 6.8 L min−1) with low power consumption. Unlike traditional motor‐driven VADs, it is lightweight, quiet, energy‐efficient, and provides pulsatile flow. Validated in a simulated circulation system,
Amine Benouhiba+6 more
wiley +1 more source
novoStoic2.0: An integrated framework for pathway synthesis, thermodynamic evaluation, and enzyme selection. [PDF]
Upadhyay V, Anand M, Maranas CD.
europepmc +1 more source
A Co-Adaptive Brain-Computer Interface for End Users with Severe Motor Impairment
Josef Faller+5 more
openalex +2 more sources
Microcellular Poly (Ethylene‐Co‐Vinyl Acetate)/Lignin Nanocomposites for Soft Ferroelectrets
Lignin valorization for advanced porous polymer nanocomposites development and an upscaling route for continuous manufacturing of soft ferroelectrets for energy harvesting are studied. This work examines the role of lignin and carbon nanotubes (CNT) in modifying the mechanical, dielectric, and ferroelectret properties of poly (ethylene‐co‐vinyl acetate)
Yuchen Lian+5 more
wiley +1 more source
Barriers to and mediators of brain–computer interface user acceptance: focus group findings
Stefanie Blain-Moraes+4 more
semanticscholar +1 more source
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke+3 more
wiley +1 more source
Redesigning Multimodal Interaction: Adaptive Signal Processing and Cross-Modal Interaction for Hands-Free Computer Interaction. [PDF]
Quan BH, Anh NDT, Phi HV, Thanh BT.
europepmc +1 more source