Results 231 to 240 of about 310,027 (287)

A Hydrogen Sulfide–Releasing Dynamic Hydrogel Modulates Coordinated Neurovascular, Immune, and Angiogenic Responses for Scar‐Suppressed Diabetic Wound Repair

open access: yesAdvanced Science, EarlyView.
ROS‐Responsive H2S Hydrogel (HAPPF) Coordinated Regeneration for High‐Quality Diabetic Wound Repair.A self‐regulating dynamic hydrogel is developed to deliver a fluorogenic H2S donor in response to excessive ROS. Released H2S acts as a master regulator to resolve chronic inflammation (M2 polarization), restore VEGF‐driven angiogenesis, and rebalance ...
Xuyang Ning   +7 more
wiley   +1 more source

Flexible Thin‐Film Heater Composed of Laser‐Induced Graphene and Poly(D, L‐Lactic Acid) with Electro‐ and Photo‐Thermal Properties toward Cancer Thermotherapy

open access: yesAdvanced Electronic Materials, EarlyView.
This study introduces a thin‐film‐type heat‐generating device that uses laser induced graphene (LIG) on a poly(D, L‐lactic) acid film, which realizes both resistance heating by direct current application and photothermal conversion heating by near‐infrared light irradiation.
Masato Saito   +4 more
wiley   +1 more source

A General and Efficient Framework for the Rapid Design of Miniaturized, Wideband, and High‐Bit RIS

open access: yesAdvanced Electronic Materials, EarlyView.
A general and efficient framework is proposed for the rapid design of high‐performance reconfigurable intelligent surfaces (RISs). This framework integrates advanced antenna design techniques and incorporates various load types, quantities, and values to achieve the design of high‐performance RISs.
Jun Wei Zhang   +14 more
wiley   +1 more source

Emerging Memory and Device Technologies for Hardware‐Accelerated Model Training and Inference

open access: yesAdvanced Electronic Materials, EarlyView.
This review investigates the suitability of various emerging memory technologies as compute‐in‐memory hardware for artificial intelligence (AI) applications. Distinct requirements for training‐ and inference‐centric computing are discussed, spanning device physics, materials, and system integration.
Yoonho Cho   +6 more
wiley   +1 more source

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