Results 131 to 140 of about 132,554 (306)

Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging. [PDF]

Sensors (Basel), 2022
Matsumae T, Kariya S, Kurashima Y, Thu LHH, Higurashi E, Hayase M, Takagi H.   +6 more
europepmc   +1 more source

Комплексный показатель качества упаковки и рекламной продукции, изготовленных вакуумным формированием [PDF]

, 2013
У роботі представлено результати досліджень комплексного показника якості паковань та рекламної продукції, що виготовлені вакуумним формуванням, досліджено вплив факторів на якість виготовлення даного виду продукції методом експертних оцінок та ...
Khmiliarchuk, O. I., Pryimenko, O. A., Прийменко, О. А., Хмілярчук, О. І.   +3 more
core  

Effect of Laser Deoxidation on Adhesive‐Bonded Aluminum in an Oxygen‐Free Atmosphere

Advanced Engineering Materials, EarlyView.
This study investigates laser ablation of aluminum under oxygen‐free conditions. The goal is to produce oxide‐free substrates that enable improved adhesive bonding with epoxy. Optimized laser parameters (90% overlap, 300 µJ) combined with oxide‐free substrates result in the highest tensile strength of the adhesive bond.
Sandra Gerland, Finn‐Lennard Janthur, Sarah Seffer, Jörg Hermsdorf, Ludger Overmeyer, Annika Raatz   +5 more
wiley   +1 more source

Vacuum Packaging Maintains Fresh Characteristics of Previously Frozen Beef Steaks during Simulated Retail Display. [PDF]

Foods, 2022
Wagoner MP, Reyes TM, Zorn VE, Coursen MM, Corbitt KE, Wilborn BS, Starkey CW, Brandebourg TD, Belk AD, Bonner T, Sawyer JT.   +10 more
europepmc   +1 more source

High Density Through Silicon Via (TSV) [PDF]

, 2008
The Through Silicon Via (TSV) process developed by Silex provides down to 30 micrometers pitch for through wafer connections in up to 600 micrometers thick substrates. Integrated with MEMS designs it enables significantly reduced die size and true "Wafer
Bauer, Tomas, Rimskog, Magnus
core   +1 more source

Four‐Point Bending Tests at High Temperatures on Commercial MgO‐C Refractory Bricks with and Without Recyclate Considering Different Carbon Contents

Advanced Engineering Materials, EarlyView.
Four‐point bending tests are conducted in an argon atmosphere on commercial MgO‐C brick grades with and without MgO‐C recyclate from room temperature up to 1300 °C. No detrimental effect of the MgO‐C recyclates on bending strength is found. Instead, a decisive influence of the total carbon content is observed, with lower total carbon contents ...
Alexander Schramm, Lukas Knöchel, Thomas Schemmel, Christos G. Aneziris, Anja Weidner, Horst Biermann   +5 more
wiley   +1 more source

Effects of immersing treatment of curcumin and piperine combined with vacuum packaging on the quality of salmon (Salmo salar) during cold chain logistics. [PDF]

Front Nutr, 2022
Qian YF, Yu JY, Yu YJ, Xie J, Yang SP.
europepmc   +1 more source

Effectiveness of Ozone Treatment and Packaging Techniques in Preserving Taiwanese Domestic Beef During Refrigerated Storage

Foods
This study investigates the efficacy of ozone treatment combined with different packaging methods on the preservation of Taiwanese domestically produced beef during refrigerated storage.
Chao-Wei Huang, Shiro Takeda, Yen-Po Chen, Fu-Yuan Cheng, Pei-Jung Wu, Liang-Chuan Lin, Yu-Tse Liu   +6 more
doaj   +1 more source

Investigation of Thermo‐Chemical Processes in Commercial MgO‐C Refractory Bricks With and Without MgO‐C Recyclate at Elevated Temperatures

Advanced Engineering Materials, EarlyView.
This study investigates thermo‐chemical processes during high‐temperature testing of two commercial MgO‐C brick grades, one containing 47.5 wt.% MgO‐C recyclate. Using ETV, DTA/TG‐MS, XRD, and SEM/EDS/EBSD, mechanisms such as carbothermal reduction of magnesia, impurity incorporation into the secondary MgO surface layer, and calcium‐rich phase ...
Alexander Schramm, Jana Hubálková, Christian Schimpf, Thomas Schemmel, Christos G. Aneziris, Anja Weidner, Horst Biermann   +6 more
wiley   +1 more source

Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging. [PDF]

Microsyst Nanoeng, 2022
Kariya S, Matsumae T, Kurashima Y, Takagi H, Hayase M, Higurashi E.   +5 more
europepmc   +1 more source