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Vacuum Degree Measurement of MEMS Vacuum Package Based on DDS
2006 7th International Conference on Electronic Packaging Technology, 2006This paper adopts quartz crystal as a sensor for measurement of vacuum degree which is integrated into the internal cavity of the MEMS package and is excited by an exciting source which is formed by Direct Digital Synthesizer (DDS). The corresponding voltage signal is provided as output by using phase and amplitude comparision circuits to compare the ...
Xiong Shi +3 more
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Vacuum packaging design and analysis for UFPA
SPIE Proceedings, 2010ABSTRACT Uncooled focal plane array (UFPA) has broad application prospects in civilian and space because its cheaper, more compact and high reliability. Many research institutes and companies have carried out the research of uncooled focal plane array. This paper shows a vacuum package design of UF PA, and its architecture will be given.
Dafu Liu, Qinfei Xu
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Assessment of vacuum lifetime in nL-packages
2005 7th Electronic Packaging Technology Conference, 2005Vacuum wafer bonding technology provides a number of very effective techniques to produce low-cost, hermetic sealed packages for micromachined sensors and actuators. Beside the protection of the device from outside environmental stresses, the package must also provide a cavity ambient compatible with the device performance and reliability.
W. Reinert, D. Kahler, G. Longoni
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Vacuum underfill technology for advanced packaging
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011We developed vacuum assisted underfill technology for large die (>18 × 18 mm) with fine pitch area array bumps (< 150 μm pitch) to solve a critical underfill void issue. Material development and process optimization are the keys to realize a stable process for such an advanced package.
A. Horibe +16 more
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Hermeticity Investigation of MEMS Vacuum Packaging
2006 7th International Conference on Electronic Packaging Technology, 2006The vacuum packaging is one of the most difficult problems to solve in the MEMS. In the MEMS vacuum packaging, the most important quality standard is the leak rate, which determines the vacuum maintaining in the vacuum packages. This paper presents two methods together to measure the leak rate.
Dong Lin +5 more
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Modified atmospheres and vacuum packaging
2003The ability of modified-atmosphere packaging (MAP) to extend the shelf-life of foods has been known for a long time. First, the delaying effects of MAP or controlled-atmosphere storage (CAP) on the ripening of fruits and vegetables were discovered. In the 1920s, studies at the Low Temperature Research Station in Cambridge, UK, demonstrated that the ...
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Reliability of MEMS packaging: vacuum maintenance and packaging induced stress
Microsystem Technologies, 2005In this study, the dominant reliability issues of MEMS packaging that include vacuum maintenance and packaging induced stress, are discussed, and design considerations to improve the reliability are presented. The MEMS vibratory gyroscope sensor is fabricated with anodically bonded wafer level vacuum packaging followed by die-bonding and wire-bonding ...
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