Results 231 to 240 of about 21,521 (260)
Electroforming‐free TiN/SiOx/Cu/SiOx/TiN memristive devices exploit pancake‐like Cu nanoparticles embedded in a SiOx double layer to create a heterogeneous Schottky‐barrier landscape. Under bias, oxygen‐vacancy redistribution progressively lowers local barriers and recruits initially inactive Cu‐PC pathways into a parallel conduction ensemble, enabling
Rouven Lamprecht +10 more
wiley +1 more source
Volume-Law Entropy as a Mesoscopic Anomaly. [PDF]
Bougueroua L.
europepmc +1 more source
Entropy and Stability: Reduced Hamiltonian Formalism of Non-Barotropic Flows and Instability Constraints. [PDF]
Yahalom A.
europepmc +1 more source
Electromechanical Coupling Analysis of a Piezoelectric-Flexoelectric-Semiconductor Cantilever Beam. [PDF]
Su Y, Wu X, Zhou Z.
europepmc +1 more source
A Sequence-Specific Theory for Charge-Regulating IDPs. [PDF]
Beyer D, Holm C, Wang ZG.
europepmc +1 more source
Mesh variational r-adaptivity for sharp modeling of brittle fracture
Dony G, Moës N, Remacle J.
europepmc +1 more source

