Results 11 to 20 of about 587 (189)

A warpage-free Si3N4 slurry strategy for vat photopolymerization [PDF]

open access: yesJournal of Advanced Ceramics
Si3N4 ceramics are promising wave-transparent materials with excellent mechanical and dielectric properties. Vat photopolymerization (VPP) three-dimensional (3D) printing provides a strategy for preparing ceramics with controllable complex structures ...
Chi Huang   +4 more
doaj   +3 more sources

Self-Healing and Reprocessable Soft Robots Using 3D Digital Light Printing. [PDF]

open access: yesAdv Sci (Weinh)
This work advances 3D digital light printing of soft robots made from self‐healing, recyclable elastomers enabled by dynamic covalent bonds. With the introduction of room‐temperature healing, these robots recover their mechanical performance (94.5% static, 87.5% dynamic) after damage and maintain their functionality.
Yuan C   +11 more
europepmc   +2 more sources

Additive Manufacturing of Neuromorphic Systems. [PDF]

open access: yesAdv Mater
The crossover of additive Manufacturing (AM) and neuromorphic engineering promises a new paradigm in the fabrication of intelligent hardware—one that is sustainable, scalable, cost‐efficient, and customizable. The AM‐printed neuromorphic hardware (electronics and mechanical systems) is examined, and we discussed the technological integration.
Yan J, Su Y, Armstrong JPK, Gleadall A.
europepmc   +2 more sources

Making foam-like bioactive glass scaffolds by vat photopolymerization [PDF]

open access: yes, 2023
This study explores the feasibility of bioactive glass scaffolds by using a stereolithographic technology (digital light processing-based vat photopolymerization) as fabrication method and the micro-tomographic reconstruction of an open-cell polymeric ...
Alidoost M.   +4 more
core   +1 more source

Exploring the Applicability of Sinterjoining to Combine Additively Manufactured Ceramic Components [PDF]

open access: yes, 2022
This paper examines the general applicability of sinterjoining for combining the advantages of Ceramic Injection Molding (CIM) and Additive Manufacturing (AM) as well as different AM processes.
End, Yannik   +3 more
core   +2 more sources

Issues in resolution and build size scaling of additive manufacturing technologies [PDF]

open access: yes, 2022
In this review, scaling issues in additive manufacturing (AM) processes are discussed based on multiple factors. Scaling issues arise mainly due to design and control of the AM system and also while attempting to achieve desired accuracy.
Biswas, Agnimitra   +2 more
core   +3 more sources

Features of Vat-Photopolymerized Masters for Microfluidic Device Manufacturing. [PDF]

open access: yesBioengineering (Basel)
The growing interest in advancing microfluidic devices for manipulating fluids within micrometer-scale channels has prompted a shift in manufacturing practices, moving from single-component production to medium-size batches. This transition arises due to
Gatto ML   +7 more
europepmc   +3 more sources

Design of Reliable Remobilisation Finger Implants with Geometry Elements of a Triple Periodic Minimal Surface Structure via Additive Manufacturing of Silicon Nitride [PDF]

open access: yes, 2023
When finger joints become immobile due to an accident during sports or a widespread disease such as rheumatoid arthritis, customised finger joint implants are to be created.
Czekalla, Martin   +10 more
core   +1 more source

Computational models for the simulation of the elastic and fracture properties of highly porous 3D-printed hydroxyapatite scaffolds [PDF]

open access: yes, 2023
Bone scaffolding is a promising approach for the treatment of critical-size bone defects. Hydroxyapatite can be used to produce highly porous scaffolds as it mimics the mineralized part of bone tissue, but its intrinsic brittleness limits its usage ...
Baino F.   +6 more
core   +2 more sources

Process Combination of VPP-LED and Vacuum Die Casting for Producing Complex Ceramic 3D-MID [PDF]

open access: yes, 2022
Future developments lead to increasing demands on mechatronic integrated devices (MID). Therefore, ceramics have to be used as substrate material and conductor tracks have to be located in the interior of components to be sufficiently protected.
Rosen, M.   +4 more
core   +2 more sources

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