Results 141 to 150 of about 869,656 (316)

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

Residual Stress States in Microstructurally Graded PBF–LB/M Austenitic Steel Components

open access: yesAdvanced Engineering Materials, EarlyView.
This study examines microstructurally graded 316L rectangular tube profiles fabricated via PBF–LB/M using a dual‐laser system. A 1 kW top‐hat and a 400 W Gaussian laser create distinct grain sizes and crystallographic texture. Mechanical properties are linked to microstructural evolution driven by processing conditions.
Nico Möller   +5 more
wiley   +1 more source

Crystal‐Symmetry‐Driven Build Orientation and its Impact on the {110}<100> Goss Texture Formation and Mechanical Properties of Laser Powder Bed Fused AISI 316L

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores a crystal‐symmetry‐based approach to optimize mechanical properties in laser powder bed fused AISI 316L with predominant {110}<100> Goss textures. By varying the build orientation, the microstructure can be tailored and the tensile properties optimized. The tilted build (T110) achieved the highest strength while preserving ductility,
Daniel Rainer   +7 more
wiley   +1 more source

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