Nucleobase-ascorbate transporter OsNAT9 regulates seed vigor and drought tolerance by modulating ascorbic acid homeostasis in rice. [PDF]
Liao S+15 more
europepmc +1 more source
Development of Aluminum Scandium Alloys for Hydrogen Storage Valves
Different aluminum alloy series and various aluminum‐scandium alloys with differing Sc and Zr levels are evaluated for use in hydrogen storage valve production. The alloys undergo hardness testing, optical microscopy, and tensile strength analysis, with hardening behavior studied under varying conditions.
Francisco García‐Moreno+4 more
wiley +1 more source
Beyond lifestyle, logic and empathy: subjective health, mood, emotional intelligence, and personality as keys to well-being for women and men. [PDF]
Majauskiene D+7 more
europepmc +1 more source
A multimaterial approach is introduced to improve upon auxetic structures by combining two different polymers into the same reentrant honeycomb structure via additive manufacturing. The deformation behavior as well as the resulting Poisson's ratio are thereby improved significantly.
Alexander Engel+2 more
wiley +1 more source
The Physiological and Biochemical Mechanisms Bioprimed by Spermosphere Microorganisms on <i>Ormosia henryi</i> Seeds. [PDF]
Ge M, Wei X, Fan Y, Wu Y, Fan M, Tian X.
europepmc +1 more source
Vacuum‐Formed Composites Based on a Polyolefin and a High Content of Biomass‐Waste Fillers
It is shown here that by the use of a very ductile polymer matrix, it is possible to vacuum‐form products that contain up to 25% of hard biofillers with still ductile properties. The results are promising and opens up for the use of engineered biocomposites derived from industrial side‐stream biofillers in vacuum‐formed products. A strategy to increase
Susanna K. Källbom+6 more
wiley +1 more source
The expression of Aldo-keto reductase gene OsKOB1 coordinates ABA homeostasis and antioxidant defense to maintain seed vigor under osmotic stress. [PDF]
Tian J+9 more
europepmc +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
Boosting your mood: How exercise and the amygdala dance together. [PDF]
Ge LK+7 more
europepmc +1 more source