Results 211 to 220 of about 52,732 (296)

AI‐Enhanced Vibrational Capsule for Minimally Invasive Detection of Abnormal Bowel Tissue

open access: yesAdvanced Science, EarlyView.
A fully integrated vibration‐assisted capsule is presented for the minimally invasive detection of bowel lesions. The capsule incorporates a wireless sensor and an eccentric motor to probe tissue mechanics in situ. By coupling triaxial vibration signals with AI‐based classification and analytical modeling, the system enables early, non‐visual ...
Xizheng Fang   +6 more
wiley   +1 more source

Brain‐Adhesive Bioelectronics With Shape‐Morphable and Biodegradable Properties for Stable Brain Signal Monitoring

open access: yesAdvanced Science, EarlyView.
A brain‐adhesive sensor (B‐Sensor) was developed by integrating a self‐healing biodegradable elastomer, a tissue‐adhesive hydrogel, and molybdenum electrodes. The B‐Sensor adheres to brain tissue, conforms to cortical curvatures, and maintains stable electrical performance over the intended period for reliable recording of spatiotemporal brain activity
Heewon Choi   +8 more
wiley   +1 more source

Substituent‐Based Modulation of Self‐Assembly and Immunogenicity of Amphipathic Peptides

open access: yesAdvanced Science, EarlyView.
This study systematically investigates how positional and subtle changes, such as substituents on the phenyl ring attached to short amphipathic peptides, influence their self‐assembly, fibril morphology, and immunogenic responses. ABSTRACT Self‐assembled peptide‐based biomaterials provide versatile platforms for biomedical uses, featuring customizable ...
Anirban Das   +13 more
wiley   +1 more source

A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics

open access: yesAdvanced Science, EarlyView.
Reliable soft sensors are essential for precise control in soft medical robots such as endoscopes. We developed ultrathin silicon piezoresistive sensors and their oil‐lubricated slidable packaging, which enables high‐fidelity shape sensing of silicon gauges by mechanically isolating the sensing element within a dual‐layer film.
Hao Liu   +7 more
wiley   +1 more source

Thermally Induced Creep and Viscoelastic Behavior of Copper Micropillar Arrays

open access: yesAdvanced Science, EarlyView.
Copper micropillar arrays are fabricated by electrodeposition within through‐glass‐via, and their thermally induced time‐dependent deformation is quantified. Nanoindentation creep, EBSD, and TEM reveal a heat‐treatment‐driven transition between grain‐boundary‐mediated deformation and dislocation‐dominated creep, while Kelvin modeling captures ...
Miao Wang   +14 more
wiley   +1 more source

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