Results 51 to 60 of about 10,551 (221)
Imaging the Perpendicular Plasma Dynamics Driving a Discrete Auroral Arc
Abstract Measurements of motions and structuring in auroral luminosity are combined with magnetically connected plasma measurements from the Reimei spacecraft to image the perpendicular plasma dynamics active above a discrete auroral arc. It is demonstrated how the inversion of optical flow patterns specifies the potential structure above regions of ...
C. C. Chaston
wiley +1 more source
Nickel-hydrogen low-Earth-orbit test program [PDF]
The incorporation of nickel-hydrogen technology for low-Earth-orbit spacecraft applications requires the establishment of a data base. An extensive test program was established to provide this data base.
Mcdermott, J. K.
core +1 more source
Electrochemical anodization enables precise, self‐aligned formation of robust oxide dielectrics under mild conditions. This concept explores its role in advancing low‐voltage, high‐frequency organic transistors, highlighting how this scalable and sustainable technique may reshape flexible electronics, from planar organic thin‐film transistors to ...
Juan Wang, Amric Bonil, Hans Kleemann
wiley +1 more source
Electronic mechanisms of instability in semiconductor structures
Semiconductor crystals are difficult dynamic systems in which emergence of electric not stability is possible (failure of current, spontaneous fluctuations of current or tension, switching and a hysteresis in volt — the ampere characteristic, etc ...
L.V. Chirkova +2 more
doaj
Multipolar Resonances in Electro‐Optic Metasurfaces with Moderate Refractive Index
Electro‐optic nanoantennas with moderate refractive indices of 2.3 to 3.0 are numerically shown to sustain strong multipolar resonances, enabling efficient light confinement and EO tuning. Multipolar modes of even parity are most sensitive to variations in the refractive index.
Viktoriia E. Babicheva +1 more
wiley +1 more source
Effect of Stirring on the Defect-Free Filling of Deep Through-Silicon Vias
Through-silicon-via (TSV) is an advanced 3D electronic integration technology. In order to achieve the defect-free filling of deep TSV, forced convection is commonly applied during TSV filling process.
Feng Wang, Ximei Liu, Jinzhi Liu
doaj +1 more source
Wing-slope techniques for the analysis of Langmuir probe characteristics [PDF]
Wing-slope positive ion temperature measurement technique for Langmuir probe volt-ampere characteristic ...
Bettinger, R. T.
core +1 more source
This study introduces a cost‐effective and energy‐efficient DC Partial Charging Facility (DCPCF) for urban EV charging. Featuring three user‐defined modes, it ensures reliable operation, scalable design, and suitability for resource‐limited environments, making it ideal for roadside, hotel, and parking lot installations.
M. Subashini, V. Sumathi
wiley +1 more source
Mathematical Modeling of Dielectric Permeability and Volt-Ampere Characteristics of a Semiconductor Nanocomposite Conglomerate [PDF]
Sergey Korchagin +5 more
openalex +1 more source
Conceptual mechanization studies for a horizon definition spacecraft electrical power subsystem [PDF]
Solar cell-battery electrical power subsystem for horizon definition ...
Baltes, J. J. +7 more
core +1 more source

