Results 221 to 230 of about 19,943 (307)
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek+4 more
wiley +1 more source
The dynamic connectedness among infectious diseases, geopolitical risks, cryptocurrency, and commodity markets: Evidence from a partial and multiple wavelet analysis. [PDF]
Ben Ameur H, Jamaani F, Abu Alfoul MN.
europepmc +1 more source
A flexible NiO/graphene/polystyrene sensor is developed for real‐time temperature monitoring in food safety applications. It combines mechanical and humidity stability with fast response and low manufacturing complexity. Operating below 60 °C, this printable sensor offers a promising alternative to conventional thermistors, enabling seamless ...
Mahtab Taheri+4 more
wiley +1 more source
Distributional outcomes of urban heat island reduction pathways under climate extremes. [PDF]
Eyni A+4 more
europepmc +1 more source
Enhancing Damage Tolerance of Structures Using 3D/4D Printing Technologies
This review highlights recent advances in damage tolerance for structural design, emphasizing safety, durability, and reliability in fields like aerospace and civil engineering. It covers innovations in materials, 3D/4D printing, predictive design methods, and nature‐inspired strategies.
Morteza Sayah Irani+3 more
wiley +1 more source
A hybrid fog-edge computing architecture for real-time health monitoring in IoMT systems with optimized latency and threat resilience. [PDF]
Islam U+5 more
europepmc +1 more source
Explaining Vulnerabilities of Biased News Classifiers through Rough Sets and Granular Computing
Giuseppe Fenza+4 more
openalex +1 more source