Thermocompression bonding produces efficient surface-barrier diode [PDF]
, 1965 Thermocompression bonding of a gold wire to a gallium-arsenide wafer produces a quality surface barrier diode with fast recovery times.
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Analysis of Wafer Warpage in Diamond Wire Saw Slicing Sapphire Crystal
Applied SciencesDuring the diamond wire saw cutting process of sapphire crystals, warpage is one of the key parameters for evaluating wafer quality. Based on the thermoelasticity theory and diamond wire saw cutting theory, a finite element model for thermal analysis of ...
Yihe Liu +3 more
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High Density Through Silicon Via (TSV) [PDF]
, 2008 The Through Silicon Via (TSV) process developed by Silex provides down to 30 micrometers pitch for through wafer connections in up to 600 micrometers thick substrates. Integrated with MEMS designs it enables significantly reduced die size and true "Wafer
Bauer, Tomas, Rimskog, Magnus
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Wafer Delay Minimization in Scheduling Single-Arm Cluster Tools with Two-Space Process Modules
MathematicsIn semiconductor manufacturing, multi-space process modules (PMs) are adopted in some cluster tools for wafer processing. With multi-space PMs, a PM can have multiple wafers concurrently. Also, the internal chamber in a PM should rotate to make the robot
Chengyu Zou +4 more
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Towards wafer-size graphene layers by atmospheric pressure graphitization of silicon carbide.
Nature Materials, 2009 K. Emtsev +14 more
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Automated Array Assembly Task In-depth Study of Silicon Wafer Surface Texturizing [PDF]
Several aspects of silicon wafer surface texturizing were studied. A low cost cleaning method that utilizes recycled Freon in an ultrasonic vapor degreaser to remove organic and inorganic contaminants from the surface of silicon wafers as received from ...
Jones, G. T., Rhee, S. S.
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A comparison of industrial location behaviour within the US and European Semicondictor Industries [PDF]
Our paper analyses micro-level data from the US and European semiconductor manufacturers. In particular, we will focus on the plants undertaking the wafer manufacturing processes. We integrate a range of production technological indices with spatial data
Philip McCann, Tomokazu Arita
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Thermal and structural assessments of a ceramic wafer seal in hypersonic engines [PDF]
The thermal and structural performances of a ceramic wafer seal in a simulated hypersonic engine environment are numerically assessed. The effects of aerodynamic heating, surface contact conductance between the seal and its adjacent surfaces, flow of ...
Steinetz, Bruce M., Tong, Mike T.
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MM-WAE: Multimodal Wasserstein Autoencoders for Semi-Supervised Wafer Map Defect Recognition. [PDF]
Micromachines (Basel)Zhang Y, Sun Q, Liu Z, Zhang DW.
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