Results 131 to 140 of about 436,378 (230)

Wafer-scale integration of single nanodiamonds via electrostatic-trapping. [PDF]

Nat Commun
Jing J, Wang Y, Wang Z, Luo Y, Ma L, Zhang T, Song C, Li J, Li KH, Ki DK, Kim JT, Chu Z.   +11 more
europepmc   +1 more source

Wafer-scale uniform epitaxy of transferable 2D single crystals for gate-all-around nanosheet field effect transistors. [PDF]

Nat Commun
Xue C, Tan C, Gao X, Tang J, Sun W, Yin Y, Wang M, Gao X, An H, Fu B, Liu W, Wang Y, Li Y, Ding F, Peng H.   +14 more
europepmc   +1 more source

Structurally Dependent Self-Propulsion Behaviors of Pt-SiO₂ Micromotors. [PDF]

Nanomaterials (Basel)
Zhou L, Zhao Q, Zhang H, Bao H, Cai W.
europepmc   +1 more source

Epitaxial growth of wafer-scale 2D superconductor single crystals by metal-organic chemical vapor deposition. [PDF]

Nat Commun
Wang Z, Luo T, Shi L, Chen X, Zhang J, Yao Z, Lu J, Huang Y, Zhu Z, Zheng L, Li M, Kis A, Zhang L, Zhang J.   +13 more
europepmc   +1 more source

Active inspection with knowledge distillation for cost-effective fault prediction in manufacturing process. [PDF]

Sci Rep
Heo J, Son M, Shim J.
europepmc   +1 more source

Low-Defect Bulk-Germanium-on-Insulator Photodetectors with Resonant Cavity Enhancement at 1550 nm for High-Resolution SWIR Imaging. [PDF]

Nanomaterials (Basel)
Su J, Li B, Ren Y, Du J, Duan X, Dong T, Su X, Ye T, Zhao X, Miao Y, Radamson HH.   +10 more
europepmc   +1 more source

Damage-Free Full-Thickness Dicing of Ultra-Thin GaAs Wafers Using a Femtosecond Laser with Low Residual Stress. [PDF]

Adv Sci (Weinh)
Cai S, Ding Y, Ding M, Song Q, Zhang Z, Zhang S, Zhang K, Hou Y, Yue S, Shi H, Li M, Duan W, Zhang Z.   +12 more
europepmc   +1 more source

All-fibre-coupled terahertz single-pixel imaging for biomedical applications. [PDF]

Nat Commun
Mou S, Stantchev RI, Saxena S, Ou H, Rane S, Pain SL, Murphy JD, Hendry E, Lloyd-Hughes J, Pickwell-MacPherson E.   +9 more
europepmc   +1 more source

Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding. [PDF]

Micromachines (Basel)
Zheng T, Xu Y, Mei C, Chen Y, Chang L, Yang G, Hu Q, Shi T, Yuan Y, Yu Z, Li L.   +10 more
europepmc   +1 more source

Deep reinforcement learning for scheduling semiconductor cluster tools in varying configurations. [PDF]

Sci Rep
Choi J, Kim SB.
europepmc   +1 more source