Results 11 to 20 of about 436,378 (230)
Pharmaceuticals, 2022 Curcumin is the main active constituent in turmeric, and it is one of the biopolyphenolic compounds. A cumulative body of research supports the use of curcumin in the treatment of wounds, yet poor water solubility and lack of therapeutic dose ...
Adel Al Fatease +7 more
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Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
Nature Communications, 2021 Integrating two-dimensional (2D) materials into semiconductor manufacturing lines is essential to exploit their material properties in a wide range of application areas.
A. Quellmalz +15 more
semanticscholar +1 more source
On the Complexity of Wafer-to-Wafer Integration [PDF]
Discrete Optimization, 2015 In this paper we consider the Wafer-to-Wafer Integration problem. A wafer is a p-dimensional binary vector. The input of this problem is described by m disjoints sets (called “lots”), where each set contains n wafers. The output of the problem is a set of n disjoint stacks, where a stack is a set of m wafers (one wafer from each lot).
Duvillié, Guillerme +4 more
openaire +7 more sources
100-GHz Transistors from Wafer-Scale Epitaxial Graphene [PDF]
Science, 2010 The maximum switching frequency of these devices exceeds that of silicon transistors with similar gate-electrode dimensions. The high carrier mobility of graphene has been exploited in field-effect transistors that operate at high frequencies ...
Yu-Ming Lin +6 more
semanticscholar +1 more source
Integrated wafer-scale ultra-flat graphene by gradient surface energy modulation
Nature Communications, 2022 The integration of large-scale two-dimensional (2D) materials onto semiconductor wafers is highly desirable for advanced electronic devices, but challenges such as transfer-related crack, contamination, wrinkle and doping remain.
Xingyong Gao +21 more
semanticscholar +1 more source
Wafer-scale low-loss lithium niobate photonic integrated circuits. [PDF]
Optics Express, 2020 Thin-film lithium niobate (LN) photonic integrated circuits (PICs) could enable ultrahigh performance in electro-optic and nonlinear optical devices. To date, realizations have been limited to chip-scale proof-of-concepts.
K. Luke +5 more
semanticscholar +1 more source
On the Effects of Balun on Small Antennas Performance for Animal Health- Monitoring and Tracking
Advanced Electromagnetics, 2021 This paper presents the performance evaluation of a sleeve Balun integration in the design of a flexible loop antenna for wildlife health monitoring and tracking applications. To verify the design concept, an experimental antenna is designed, fabricated,
A. Alemaryeen, S. Noghanian
doaj +3 more sources
Material Removal Model for Lapping Process Based on Spiral Groove Density
Applied Sciences, 2021 The increasing demand for single-crystal wafers combined with the increase in diameter of semiconductor wafers has warranted further improvements in thickness variation and material removal rate during lapping to ensure price competitiveness of wafers ...
Taekyung Lee +5 more
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VCSEL Quick Fabrication for Assessment of Large Diameter Epitaxial Wafers
IEEE Photonics Journal, 2022 Stripped-back representative VCSEL devices with a simple fabrication process that very closely approaches the performance of standard BCB-planarised devices have been produced. These VCSEL Quick Fabrication (VQF) devices achieve threshold currents only 0.
Jack Baker +8 more
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Number Determination of Successfully Packaged Dies Per Wafer Based on Machine Vision
Machines, 2015 Packaging the integrated circuit (IC) chip is a necessary step in the manufacturing process of IC products. In general, wafers with the same size and process should have a fixed number of packaged dies.
Hsuan-Ting Chang +2 more
doaj +1 more source