Results 211 to 220 of about 436,378 (230)

High-mobility three-atom-thick semiconducting films with wafer-scale homogeneity

Nature, 2015
Kibum Kang, Saien Xie, Lujie Huang, Yimo Han, Pinshane Y. Huang, K. Mak, Cheol‐Joo Kim, D. Muller, Jiwoong Park   +8 more
semanticscholar   +1 more source

Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures

Nature, 2017
Kibum Kang, Kan-Heng Lee, Yimo Han, Hui Gao, Saien Xie, D. Muller, Jiwoong Park   +6 more
semanticscholar   +1 more source

Wafer-to-Wafer Bonding with Saddle-Shaped Wafers

2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Shuo Kang, Serena Iacovo, Koen D’havé, Oguzhan Orkut Okudur, Anton Alexeev, Thomas Plach, Gernot Probst, Taotao Ding, Markus Wimplinger, Thomas Uhrmann, Joeri De Vos, Gerald Beyer, Eric Beyne   +12 more
openaire   +1 more source

Wafers

Notes and Queries
  +4 more sources

Wafer Substrate Impact on Direct Wafer-to-Wafer Bonding Process

2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Nathan Ip, Yuhai Xiang, Andrew Tuchman, Norifumi Kohama, Xuemei Chen, Ilseok Son, Kimio Motoda   +6 more
openaire   +1 more source

Wafer map defect pattern classification based on convolutional neural network features and error-correcting output codes

Journal of Intelligent Manufacturing, 2020
C. Jin, Hyun-Jin Kim, Yongjun Piao, Meijing Li, Minghao Piao   +4 more
semanticscholar   +1 more source

Wafer-Bonding Equipment

2010
Viorel Dragoi, Paul Lindner
openaire   +1 more source

Direct wafer bonding technology of 300mm wafer

Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials, 2011
S. Hongo, K. Tanida, N. Yamaguchi, K. Takahashi   +3 more
openaire   +1 more source

wafer

2000
openaire   +1 more source

Exact wafer matching process wafer to wafer inegration

2012
Giroudeau, Rodolphe, Di Natale, Giorgio, Flottes, Marie-Lise, Hernandez, Florent   +3 more
openaire   +1 more source