Results 21 to 30 of about 436,378 (230)
High efficiency InGaAs solar cells on Si by InP layer transfer [PDF]
InP/Si substrates were fabricated through wafer bonding and helium-induced exfoliation of InP, and InGaAs solar cells lattice matched to bulk InP were grown on these substrates using metal-organic chemical-vapor deposition.
Atwater, Harry A. +5 more
core +1 more source
Synchrotron X-ray rocking curve imaging (RCI) is modified to visualize local bending of lattice planes of a single crystal substrate (XR-V-LBLP). This method uses two-azimuth RCI datasets of asymmetric reflection or symmetric reflection.
Osami Sakata, Shinjiro Yagyu
doaj +1 more source
Observation of nano-indent induced strain fields and dislocation generation in silicon wafers using micro-raman spectroscopy and white beam x-ray topography [PDF]
In the semiconductor manufacturing industry, wafer handling introduces micro-cracks at the wafer edge. During heat treatment these can produce larger, long-range cracks in the wafer which can cause wafer breakage during manufacture.
A. Zlotos +29 more
core +1 more source
Subsurface drip irrigation of tomatoes: Drip system design, management promote seed emergence
Subsurface drip irrigation has a number of potential advantages over conventional surface irrigation; it curtails weed growth and reduces water loss due to high irrigation uniformity.
Larry Schwankl +2 more
doaj +1 more source
Performance of a novel wafer scale CMOS active pixel sensor for bio-medical imaging [PDF]
Recently CMOS Active Pixels Sensors (APSs) have become a valuable alternative to amorphous Silicon and Selenium Flat Panel Imagers (FPIs) in bio-medical imaging applications.
A C Konstantinidis +23 more
core +1 more source
Compressed sensing with near-field THz radiation [PDF]
We demonstrate a form of near-field terahertz (THz) imaging that is compatible with compressed sensing algorithms. By spatially photomodulating THz pulses using a set of shaped binary optical patterns and employing a 6-μm-thick silicon wafer, we are able
Hendry, Euan +5 more
core +1 more source
Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers.
Zhihao Ren +3 more
semanticscholar +1 more source
A Review of Data Mining with Big Data towards Its Applications in the Electronics Industry
Data mining (DM) with Big Data has been widely used in the lifecycle of electronic products that range from the design and production stages to the service stage.
Shengping Lv +3 more
doaj +1 more source
Influence of the synthesis conditions of silicon nanodots in an industrial low pressure chemical vapor deposition reactor [PDF]
Experiments conducted in an industrial tubular low pressure chemical vapor deposition (LPCVD) reactor have demonstrated the reproducibility and spatial uniformity of silicon nanodots (NDs) area density and mean radius.
Billon, Thierry +4 more
core +3 more sources
Silicon carbide (SiC), a wide-bandgap semiconductor, is renowned for its exceptional performance in power electronics and extreme-temperature environments.
Heng Wang +6 more
doaj +1 more source

