Results 71 to 80 of about 436,378 (230)

Evaluation of Whey Protein Wafer Supplementation on The Performance and Blood Profile of Weaning Sheep

Animal Production: Indonesian Journal of Animal Production
The provision of feeder sheep is a problem for farmers due to a high mortality rate among pre- and post-weaned lambs. Whey protein contains amino acids, glucose, and immunoglobulin which facilitate immunity enhancement and body weight gain.
Widya Dwi Prasetyoningrum, Yuli Retnani, Tekad Urip Sujarnoko   +2 more
doaj   +1 more source

Penggunaan Limbah Kopi Sebagai Bahan Penyusun Ransum Itik Peking dalam Bentuk Wafer Ransum Komplit

Jurnal Agripet, 2013
Effect of coffee waste as component of compiler ration peking duck in the form of wafer complete ration ABSTRACT. Coffee waste is a by-product of coffee processing that potential to be used as feed stuff for peking duck.
Muhammad Daud, Zahrul Fuadi, Sultana Sultana   +2 more
doaj   +1 more source

The effect of the chuck shape on the wafer topography in back grinding of wafer with outer rim

Advances in Mechanical Engineering, 2021
Back Grinding of Wafer with Outer Rim (BGWOR) is a novel method for carrier-less thinning of silicon wafers. Silicon wafers are widely used in integrated circuits (ICs).
Xianglong Zhu, Weihua Yao, Xiaoguang Guo, Renke Kang, Muhammad Jawad Ahmad   +4 more
doaj   +1 more source

Parasitic Effects Reduction for Wafer-Level Packaging of RF-Mems [PDF]

, 2006
In RF-MEMS packaging, next to the protection of movable structures, optimization of package electrical performance plays a very important role. In this work, a wafer-level packaging process has been investigated and optimized in order to minimize ...
Bartek, M., Gaddi, R., Gnudi, A., Iannacci, J., Sinaga, S., Tian, Jason   +5 more
core   +2 more sources

Room temperature strain-induced Landau levels in graphene on a wafer-scale platform [PDF]

Science Advances, 2019
Strain-induced Landau levels in wafer-scale graphene at room temperature are studied using momentum-resolved spectroscopy. Graphene is a powerful playground for studying a plethora of quantum phenomena. One of the remarkable properties of graphene arises
P. Nigge, A. Qu, É. Lantagne-Hurtubise, E. Mårsell, E. Mårsell, G. Tom, M. Zonno, M. Michiardi, M. Michiardi, M. Schneider, S. Zhdanovich, G. Levy, U. Starke, C. Gutiérrez, D. Bonn, S. Burke, M. Franz, A. Damascelli   +17 more
semanticscholar   +1 more source

Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures

Nanomaterials, 2019
Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest because it offers high production efficiency and compact modules.
Shuping Xie, Xinjun Wan, Bo Yang, Wei Zhang, Xiaoxiao Wei, Songlin Zhuang   +5 more
doaj   +1 more source

Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application

Micromachines, 2018
In this paper, we present our work developing a family of silicon-on-insulator (SOI)–based high-g micro-electro-mechanical systems (MEMS) piezoresistive sensors for measurement of accelerations up to 60,000 g.
Xiaodong Hu, Piotr Mackowiak, Manuel Bäuscher, Oswin Ehrmann, Klaus-Dieter Lang, Martin Schneider-Ramelow, Stefan Linke, Ha-Duong Ngo   +7 more
doaj   +1 more source

Anomaly Detection and Segmentation for Wafer Defect Patterns Using Deep Convolutional Encoder–Decoder Neural Network Architectures in Semiconductor Manufacturing

IEEE transactions on semiconductor manufacturing, 2019
Abnormal defect pattern detection plays a key role in preventing yield loss excursion events for the semiconductor manufacturing. We present a method for detecting and segmenting abnormal wafer map defect patterns using deep convolutional encoder–decoder
T. Nakazawa, Deepak V. Kulkarni
semanticscholar   +1 more source

Persentase Karkas Itik Peking yang Diberi Pakan dalam Bentuk Wafer Ransum Komplit Mengandung Limbah Kopi

Jurnal Agripet, 2016
ABSTRAK. Penggunaan wafer ransum komplit mengandung limbah kopi pada itik peking dilakukan dengan tujuan untuk mengetahui berat akhir dan persentase karkas.
Muhammad Daud, Mulyadi Mulyadi, Zahrul Fuadi   +2 more
doaj   +1 more source

A Method for Wafer Defect Detection Using Spatial Feature Points Guided Affine Iterative Closest Point Algorithm

IEEE Access, 2020
In integrated circuit manufacturing industry, in order to meet the high demand of electronic products, wafers are designed to be smaller and smaller, which makes automatic wafer defect detection a great challenge.
Jing Yang, Yi Xu, Hai-Jun Rong, Shaoyi Du, Hongmei Zhang   +4 more
doaj   +1 more source