Results 241 to 250 of about 1,465,596 (360)

High Removal Efficiency of Radioactive Iodine with In Situ-Synthesized Ag2O–Mg(OH)2 Plate Composites

open access: yesACS Omega
Chunyang Zhang   +10 more
doaj   +1 more source

Research Progress of Phase Change Materials for Thermal Management in Electronic Components

open access: yesAdvanced Materials Interfaces, EarlyView.
Phase change materials(PCMs) can effectively solve the overheating problem in electronic devices during use, but the low themal conductivity of PCM itself hinders its development. The problem of low thermal conductivity can be addressed by using metal fins, adding nanparticles and porous metal foams.
Xinbo Zheng   +10 more
wiley   +1 more source

3D Printing of Highly Electrically Conductive Zinc for Sustainable Electronics Applications

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A 3D printable zinc ink system with active zinc particles in a shellac matrix is demonstrated. The results show high conductivity, stable performance of printed structures under varying humidity conditions, and promising application in disposable water‐activated batteries. This technology combining digital material assembly, reliable operation, and non‐
Xavier Aeby   +5 more
wiley   +1 more source

A Microfluidic Multiplex Sorter for Strain Development

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A new multiplex method for high‐throughput screening of yeast strains based on glucoamylase production is presented. Droplets containing single mutant yeast cells are incubated for enzyme production. A sorting platform divides mutants by their high‐ and mid‐activity levels.
Chiara Leal‐Alves   +6 more
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

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