High Removal Efficiency of Radioactive Iodine with In Situ-Synthesized Ag2O–Mg(OH)2 Plate Composites
Chunyang Zhang+10 more
doaj +1 more source
Survey data on firm-level surplus food and food waste management from the Italian food processing industry. [PDF]
Valentini G+3 more
europepmc +1 more source
WASTE MANAGEMENT IN A SMALL, WIDELY DISPERSED MOUNTAIN COMMUNITY.
L Emelity, R. Garde, C.W. Christenson
openalex +2 more sources
Research Progress of Phase Change Materials for Thermal Management in Electronic Components
Phase change materials(PCMs) can effectively solve the overheating problem in electronic devices during use, but the low themal conductivity of PCM itself hinders its development. The problem of low thermal conductivity can be addressed by using metal fins, adding nanparticles and porous metal foams.
Xinbo Zheng+10 more
wiley +1 more source
Smart waste management and classification system using advanced IoT and AI technologies. [PDF]
Alourani A, Ashraf MU, Aloraini M.
europepmc +1 more source
3D Printing of Highly Electrically Conductive Zinc for Sustainable Electronics Applications
A 3D printable zinc ink system with active zinc particles in a shellac matrix is demonstrated. The results show high conductivity, stable performance of printed structures under varying humidity conditions, and promising application in disposable water‐activated batteries. This technology combining digital material assembly, reliable operation, and non‐
Xavier Aeby+5 more
wiley +1 more source
Applications of tunable dye lasers in reactor waste management
G. W. Gobeli+2 more
openalex +2 more sources
A Microfluidic Multiplex Sorter for Strain Development
A new multiplex method for high‐throughput screening of yeast strains based on glucoamylase production is presented. Droplets containing single mutant yeast cells are incubated for enzyme production. A sorting platform divides mutants by their high‐ and mid‐activity levels.
Chiara Leal‐Alves+6 more
wiley +1 more source
Nuclear waste management and transportation quarterly progress report, January--March 1975
A.M. Platt
openalex +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya+3 more
wiley +1 more source