Results 171 to 180 of about 35,573 (266)

A Data‐Driven Inverse Design Methodology for Magnetic Soft Millirobots Navigating in Confined Spaces

open access: yesAdvanced Science, EarlyView.
A data‐efficient inverse design framework automates the optimization of magnetic soft millirobots for confined‐space navigation. Integrating a physics‐based Cosserat rod model with Bayesian optimization efficiently identifies high‐performance geometries.
Ziyu Ren   +5 more
wiley   +1 more source

Ultrafast Dynamics of Spin Current and Electron Temperature in Spintronic Terahertz Emitters

open access: yesAdvanced Science, EarlyView.
This work quantifies optical‐pump‐induced THz transmission variations to reveal electron and lattice temperature dynamics and presents time‐resolved THz spectral maps for sub‐picosecond analysis. A 63 ± 8 fs time lag between THz emission and laser excitation is identified, serving as an intrinsic parameter limiting the upper frequency of spintronic THz
Yifan Wang   +10 more
wiley   +1 more source

Neuromorphic Near‐Sensor and In‐Sensor Computing Enabled by Next‐Generation Material‐Based Sensors

open access: yesAdvanced Science, EarlyView.
This Review presents a structural framework that classifies neuromorphic sensing into near‐sensor and in‐sensor architectures, clarifying physical coupling between sensing and computation. The framework connects neural and synaptic device functions with recent advances in optical, mechanical, and chemical sensing, compares energy consumption and ...
Su Yeon Jung   +7 more
wiley   +1 more source

Study on the Characteristics of MBN and MAE Signals in P92 Steel. [PDF]

open access: yesMaterials (Basel)
Huang Z   +6 more
europepmc   +1 more source

Stretchable Microelectrode Arrays with Microneedles for Reliable Electrophysiological Recording of Human Heart and Brain Organoids

open access: yesAdvanced Science, EarlyView.
A stretchable 3D microelectrode array with microneedles (3D MN‐sMEA) enables stable, minimally destructive electrophysiological monitoring of 3D organoids. The wafer‐level stud‐bump bonding process facilitates high‐fidelity recordings of heart and cerebral organoids.
Eunyoung Jang   +10 more
wiley   +1 more source

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