Results 271 to 280 of about 2,934,260 (371)

Cottonseed‐Derived Reusable Bio‐Carbon Gel Ink for DIW Printing Soft Electronic Textiles

open access: yesAdvanced Materials, EarlyView.
A reusable carbon‐gel ink, incorporating cottonseed peptone as a natural mediator, enables cross‐linked ionic polymer networks for advanced conductivity, stability, and biocompatibility. Compatible with direct‐ink‐writing, it facilitates flexible electronics on polymeric and textile substrates for multifunctional applications, including motion sensing,
King Yan Chung   +7 more
wiley   +1 more source

DRMAAtic: dramatically improve your cluster potential. [PDF]

open access: yesBioinform Adv
Del Conte A   +6 more
europepmc   +1 more source

Van Der Waals Hybrid Integration of 2D Semimetals for Broadband Photodetection

open access: yesAdvanced Materials, EarlyView.
Advanced broadband photodetector technologies are essential for military and civilian applications. 2D semimetals, with their gapless band structures, high mobility, and topological protection, offer great promise for broadband PDs. This study reviews the latest advancements in broadband PDs utilizing heterostructures that combine 2D semimetals with ...
Xue Li   +9 more
wiley   +1 more source

10 Years Development of Potassium‐Ion Batteries

open access: yesAdvanced Materials, EarlyView.
Significant progress is made in PIBs over the past decade, but the improvements based on half‐cell testing, low mass loading, and low energy density are insufficient for practical applications. This review summarizes the challenges and strategies for PIBs, highlights the importance of further research focusing on full cells, and provides an analysis of
Mingnan Li   +7 more
wiley   +1 more source

A Practical Guide to Improving Web Accessibility

open access: yesWeave: Journal of Library User Experience, 2017
Cynthia Ng
doaj   +1 more source

Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration

open access: yesAdvanced Materials, EarlyView.
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa   +9 more
wiley   +1 more source

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