Results 171 to 180 of about 633,950 (258)

A Cascaded DNA Nanocircuit for Multi‐Signal‐Responsive Precision siRNA Delivery in Cancer Therapy

open access: yesAdvanced Science, EarlyView.
A cascaded dual‐AND logic DNA nanocircuit is engineered to respond to three tumor‐specific signals in a sequential manner: extracellular acidic pH, membrane‐overexpressed nucleolin (NCL), and intracellular glutathione (GSH). This programmable system selectively releases siPARP1 in glioblastoma (GBM), effectively silencing PARP1 and reversing TMZ ...
Yan Zhao   +14 more
wiley   +1 more source

Repurposing FDA‐Approved Drugs to Inhibit Fungal PPTases for Broad‐Spectrum Synergy

open access: yesAdvanced Science, EarlyView.
Fungal secondary metabolites serve as crucial virulence effectors; however, the potential of their biosynthetic pathways as antifungal targets remains inadequately comprehended. Repurposed FDA‐approved drugs inhibit fungal PPTase (essential for secondary metabolism) in vivo.
Zili Song   +7 more
wiley   +1 more source

Structural Basis of Shiga Toxin Neutralization by Human Antibodies Targeting Canonical Receptor‐Binding and Non‐Canonical Assembly Sites

open access: yesAdvanced Science, EarlyView.
Cryo‐electron microscopy structures reveal two distinct neutralization mechanisms of fully human monoclonal antibodies targeting the Shiga toxin 1a B subunit. RDS059 occludes the Gb3 receptor‐binding site, whereas RDS045 engages a lateral quaternary epitope to disrupt holotoxin assembly.
Jianting Ke   +10 more
wiley   +1 more source

Symbiont‐Induced HSP83 Establishes Two‐Tiered Control of Antifungal Immunity in an Invasive Beetle–Fungus Complex

open access: yesAdvanced Science, EarlyView.
In an invasive beetle–fungus complex, the mutualist Leptographium procerum induces host HSP83 and modulates Toll‐dependent antifungal immunity. HSP83 mediates two‐tiered control by associating with selected fungal recognition receptors and restraining Dorsal‐driven antimicrobial peptide transcription.
Qingtai Yang   +8 more
wiley   +1 more source

Wafer‐Scale 3D Integration for High‐Density Multi‐Valued Neuromorphic Logic

open access: yesAdvanced Science, EarlyView.
Wafer‐scale 3D vertically integrated multi‐valued logic (MVL) circuits are realized by monolithically integrating a Te/IGZO heterojunction FET with an engineered Te pull‐up FET. Heterointerface‐mediated transport and optimized current matching enable stable ternary operation, while vertical stacking reduces circuit footprint and interconnect complexity,
Chang‐Hyeon Kim   +5 more
wiley   +1 more source

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