Results 181 to 190 of about 204,518 (380)
The Formation Mechanism of White Line in Welded Joints of ERW Steel Pipes
Seiji Suzuki, Toshihiro Takamura
openalex +2 more sources
Atomic‐Level Strain Sensing and Piezoresistance Effect in a 1D Single‐Atom Chain
The atomic‐scale piezoresistance effect of the Ag single‐atom chain is explored using strain characterization and electrical measurement. Single‐atom chain has the potential to serve as a strain sensor with atomic‐level precision, overcoming the challenge of low temporal resolution in a transmission electron microscope.
Zhi Qu+6 more
wiley +1 more source
Physical Characteristics of Coupled Plasma and Its Influence on Weld Formation in Hybrid Laser-Double-Arc Welding. [PDF]
Gu X, Liu Y, Li W, Han Y, Zheng K.
europepmc +1 more source
Photo‐Thermal Approaches on Polyimide Film for Demonstration of Sub‐50 µm Polymer Stencil Mask
A photo‑thermal approach enables precise control of polyimide film properties during UV laser processing, achieving stencil mask fabrication with feature dimensions <50 µm—with the smallest features measuring 42.4 µm. This method maintains the polymer in its glassy state during processing, resulting in exceptional pattern stability and reproducibility.
Bon‐Jae Koo+6 more
wiley +1 more source
Thermal Elasto-plastic Analysis on Hot-cracking Formation in Initial-bead of Butt-welded Joints
Isamu Tsuji
openalex +2 more sources
Weld formation during material extrusion additive manufacturing. [PDF]
Seppala JE+4 more
europepmc +1 more source
This work reports ecofriendly silver nanowire based ink with cellulose as the binder for printed flexible electronics. After annealing, the cellulose binder provides excellent adhesion between nanowires and substrate, leading to robust electromechanical performance of the printed electronics without encapsulation.
Yuxuan Liu+5 more
wiley +1 more source
Laser-CMT Hybrid Welding-Brazing of Al/Steel Butt Joint: Weld Formation, Intermetallic Compounds, and Mechanical Properties. [PDF]
Chen Y, Yang Z, Shi C, Xin Z, Zeng Z.
europepmc +1 more source
Metallization in photovoltaics faces challenges due to silver dependency. This study explores Laser Metal Bonding (LMB), an ultra‐rapid, ablation‐free process enabling robust aluminum‐to‐silicon nitride connections while preserving passivation layers and cell efficiency. Combining experiments and simulations, key adhesion mechanisms, thermal thresholds,
Oliver John+4 more
wiley +1 more source