Results 181 to 190 of about 204,518 (380)

Atomic‐Level Strain Sensing and Piezoresistance Effect in a 1D Single‐Atom Chain

open access: yesAdvanced Science, EarlyView.
The atomic‐scale piezoresistance effect of the Ag single‐atom chain is explored using strain characterization and electrical measurement. Single‐atom chain has the potential to serve as a strain sensor with atomic‐level precision, overcoming the challenge of low temporal resolution in a transmission electron microscope.
Zhi Qu   +6 more
wiley   +1 more source

Photo‐Thermal Approaches on Polyimide Film for Demonstration of Sub‐50 µm Polymer Stencil Mask

open access: yesAdvanced Electronic Materials, EarlyView.
A photo‑thermal approach enables precise control of polyimide film properties during UV laser processing, achieving stencil mask fabrication with feature dimensions <50 µm—with the smallest features measuring 42.4 µm. This method maintains the polymer in its glassy state during processing, resulting in exceptional pattern stability and reproducibility.
Bon‐Jae Koo   +6 more
wiley   +1 more source

Weld formation during material extrusion additive manufacturing. [PDF]

open access: yesSoft Matter, 2017
Seppala JE   +4 more
europepmc   +1 more source

Ecofriendly Printing of Silver Nanowires with Cellulose Binder for Highly Robust Flexible Electronics

open access: yesAdvanced Electronic Materials, EarlyView.
This work reports ecofriendly silver nanowire based ink with cellulose as the binder for printed flexible electronics. After annealing, the cellulose binder provides excellent adhesion between nanowires and substrate, leading to robust electromechanical performance of the printed electronics without encapsulation.
Yuxuan Liu   +5 more
wiley   +1 more source

Interface Topology and Wetting Dynamics of Laser‐Induced Bonds Between Aluminum Foil and Silicon Nitride Passivation in Solar Cells

open access: yesAdvanced Energy Materials, EarlyView.
Metallization in photovoltaics faces challenges due to silver dependency. This study explores Laser Metal Bonding (LMB), an ultra‐rapid, ablation‐free process enabling robust aluminum‐to‐silicon nitride connections while preserving passivation layers and cell efficiency. Combining experiments and simulations, key adhesion mechanisms, thermal thresholds,
Oliver John   +4 more
wiley   +1 more source

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