Results 191 to 200 of about 73,537 (247)
This study uses real‐time laser diffraction image analysis to quantify fiber diameter changes and whipping behavior from the nozzle to the collector under varying electric field conditions. By capturing diffraction (scattering) intensity changes and bending angles, melt jet and whipping behavior are accurately assessed, supporting melt electrospinning ...
Jihwan Lim+3 more
wiley +1 more source
This study aims to establish a link between the dielectric properties of polyamide 12 (PA12) and its thermal and rheological properties using dielectric analysis (DEA). A standardized methodology is introduced to determine melting and crystallization temperatures.
Benedikt Burchard+2 more
wiley +1 more source
Ca2.5Ag0.3Sm0.2Co4O9 semiconductor materials are synthesized and produced in this study using the sol–gel and cold pressing techniques for thermoelectric generator applications. As template samples are added, the Seebeck coefficient and power factor values rise, peaking at 800 °C for Ca2.5Ag0.3Sm0.2Co4O9 at 274.47 μV K−1 and 0.58 mW mK−2, respectively.
Enes Kilinc+4 more
wiley +1 more source
The utilization of direct energy deposition (DED)‐arc additive manufacturing processes in industrial applications is increasing, and these processes have the potential for multi‐material applications. This work provides a overview of the state of research in DED‐arc made functional graded structures, to establish a link to potential industrial ...
Kai Treutler, Volker Wesling
wiley +1 more source
This study explores the effects of pixel size and spacing when fabricating electroluminescent (EL) multipixel displays. COMSOL simulations identify the impact of pixel dimensions and spacing on electric field distribution and lighting efficiency. Flexible, high‐resolution EL pixel arrays are reverse offset printed, achieving a 96% reduction in pixel ...
Huanghao Dai+3 more
wiley +1 more source
In the present study, metastable CrMnNi steels with varying chemical compositions and a concomitantly altered stacking fault energy are processed via directed energy deposition and afterwards tested via tensile tests at different temperatures. The present study shows the influence of the manufacturing process on the elemental deformation mechanisms for
Julia Richter+8 more
wiley +1 more source
The influence of Hot Isostatic Pressing (HIP) temperature on the microstructure and creep performance of powder bed fusion–laser beam processed CM247LC superalloy is investigated. Grain growth and γ’ precipitate evolution are characterized following HIP at varying temperatures.
Ahmed Fardan+4 more
wiley +1 more source