Results 211 to 220 of about 85,424 (309)

A Crack‐Based One‐Dimensional Microspheres Array Enables Thermal–Mechanical Decoupled Dual‐Functional Sensing

open access: yesAdvanced Science, EarlyView.
Inspired by Nostoc, a crack‐based one‐dimensional microspheres array (COMA) sensor is developed, which stabilizes crack geometry under isotropic expansion, enabling a predictable, monotonic thermal response from which true strain can be accurately extracted. The COMA sensor exhibits high sensitivity at ultralow deformation (gauge factor up to 89) and a
Wanqing Xu   +7 more
wiley   +1 more source

Triple‐Mode Ferroelectric Thin‐Film Transistor for Hybrid Electrical–Optical Reservoir Computing

open access: yesAdvanced Science, EarlyView.
A triple‐mode ferroelectric thin‐film transistor is developed by integrating Si3N4/HZO/IGZO layers to realize three independent memory modes: electric long‐term, electric short‐term, and optical short‐term. This single‐device architecture functions as both a reservoir and readout layer, achieving 92.43% MNIST accuracy. It offers a fully hardware‐based,
Hyeonho Lee   +9 more
wiley   +1 more source

Memristive Physical Reservoir Computing

open access: yesAdvanced Science, EarlyView.
Memristors’ nonlinear dynamics and input‐dependent memory effects make them ideal candidates for high‐performance physical reservoir computing (RC). Based on their conductance modulation, memristors can be classified as electronic or optoelectronic types.
Dian Jiao   +9 more
wiley   +1 more source

Tunable flexible capacitive sensor for dynamic pressure monitoring. [PDF]

open access: yesMicrosyst Nanoeng
Fu H   +6 more
europepmc   +1 more source

Progress in Strain Engineering of 2D‐Integrated Heterostructures for Ultrasensitive Sensors

open access: yesAdvanced Science, EarlyView.
 . ABSTRACT Two‐dimensional (2D) integrated heterostructures have emerged as a cornerstone in the advancement of next‐generation sensor technologies. These heterostructures, which combine materials with different dimensionalities, have led to significant breakthroughs in sensing performance and device integration.
That Buu Ton   +4 more
wiley   +1 more source

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