Electrical Conductivities of Conductors, Semiconductors, and Their Mixtures at Elevated Temperatures
This article presents a comprehensive review of temperature‐dependent electrical conductivity data for multiple material classes at elevated temperatures, highlighting a persistent conductivity gap between metals and semiconductors in the range of 102$\left(10\right)^{2}$– 107$\left(10\right)^{7}$ S/m. Metal–ceramic irregular metamaterials are proposed
Valentina Torres Nieto, Marcia A. Cooper
wiley +1 more source
A buried‐junction DSPEC design is introduced that leverages cascade charge transfer to enhance efficiency, stability, and versatility. This approach facilitates effective charge transfer and minimizes recombination losses, leading to significant improvements.
Jun‐Hyeok Park +8 more
wiley +1 more source
Hot-wire arc additive manufacturing of aluminum alloy with reduced porosity and high deposition rate
Wire arc additive manufacturing (WAAM) technology has attracted considerable interest in large-scale metallic components, but porosity and low deposition rate are the two dominating technical challenges in WAAM of aluminum alloy.
Rui Fu +8 more
doaj +1 more source
Remanufacturing H13 steel moulds and dies using laser metal deposition [PDF]
The exploitation of Additive Manufacturing (AM) in the repair and remanufacture of industrial components, such as moulds and dies, has become an emerging research area due to the expected reduction of replacement cost and the promise of better mechanical
Ahmad, Abdul +5 more
core +1 more source
Mechanical Testing and Microstructural Analysis of Wire Arc Additively Manufactured Steels
Wire arc additive manufacturing (WAAM) is a metal 3D printing method that allows the cost-effective and efficient production of large-scale elements, and has thus gained great interest from architects and structural engineers. Integration of this novel technology into the construction industry, however, requires the development of a clear understanding
Huang, C +4 more
openaire +4 more sources
Spectrally Tunable 2D Material‐Based Infrared Photodetectors for Intelligent Optoelectronics
Intelligent optoelectronics through spectral engineering of 2D material‐based infrared photodetectors. Abstract The evolution of intelligent optoelectronic systems is driven by artificial intelligence (AI). However, their practical realization hinges on the ability to dynamically capture and process optical signals across a broad infrared (IR) spectrum.
Junheon Ha +18 more
wiley +1 more source
Wire Arc Additive and High-Temperature Subtractive Manufacturing of Ti-6Al-4V
We investigated the fabrication and finishing of wall-profile machining by wire and arc additive manufacturing (WAAM) employing plasma welding with Ti-6Al-4V wire.
Ryotaro Miyake +3 more
doaj +1 more source
Broadband, Flexible, Skin‐Compatible Carbon Dots/Graphene Photodetectors for Wearable Applications
Broadband, flexible photodetectors integrating nitrogen‐rich carbon dots with single‐layer graphene on plastic substrates are demonstrated. A biocompatible chitosan–glycerol electrolyte enables efficient low‐voltage gating and on‐skin operation. The devices exhibit ultraviolet‐to‐near‐infrared response, mechanical robustness under bending, and verified
Nouha Loudhaief +20 more
wiley +1 more source
A Carrier Signal Approach for Intermittent Fault Detection and Health Monitoring for Electronics Interconnections System [PDF]
: Intermittent faults are completely missed out by traditional monitoring and detection techniques due to non-stationary nature of signals. These are the incipient events of a precursor of permanent faults to come.
Ahmad, Syed Wakil +3 more
core +1 more source
This study presents a versatile approach to harnessing miscible aqueous domains, enabling liquid‐in‐liquid compartmentalization using a barrier formed in situ rather than bulk immiscibility. The barrier forms upon the complexation of multifunctional nanoparticles and ligands at the contact boundary of aqueous phases.
Seyyed Alireza Hashemi +7 more
wiley +1 more source

