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Understanding the Nanoindentation Edge Effect of Single-Crystal Silicon Using Molecular Dynamics Simulations. [PDF]
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Validation of Hole-Drilling Residual Stress Measurements in Workpieces of Various Thickness
M. C. Lakey, Michael R. Hill
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Workpiece Measurement Device—Workpiece Height Classification
2020With Industry 4.0 taking over the facilities and machine vision is ubiquitous, legacy machines fall behind and become unnecessary burden, while still being able to operate and produce for years to come. This paper presents prototype of one of the devices that will enable legacy machines to catch up with inevitable changes.
Ermin Podrug, Slobodan Lubura
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