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Multi-color imaging with silicon-on-insulator diode uncooled infrared focal plane array using through-hole plasmonic metamaterial absorbers | IEEE Conference Publication | IEEE Xplore

Multi-color imaging with silicon-on-insulator diode uncooled infrared focal plane array using through-hole plasmonic metamaterial absorbers


Abstract:

This paper reports a silicon-on-insulator diode uncooled infrared focal plane array (IRFPA) with through-hole plasmonic metamaterial absorbers (TH-PLMAs) for multi-color ...Show More

Abstract:

This paper reports a silicon-on-insulator diode uncooled infrared focal plane array (IRFPA) with through-hole plasmonic metamaterial absorbers (TH-PLMAs) for multi-color imaging with a 320×240 array format. Through-holes formed on the PLMA can reduce the thermal mass while maintaining both the single-mode and high absorption due to plasmonic metamaterial structures, which results in fast response and high responsivity. The detection wavelength of the PLMA with through-holes can be controlled over a wide range of the IR spectrum by varying the size of the micropatches on the top layer.
Date of Conference: 18-22 January 2015
Date Added to IEEE Xplore: 02 March 2015
Electronic ISBN:978-1-4799-7955-4
Print ISSN: 1084-6999
Conference Location: Estoril, Portugal

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