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Device reliability challenges for modern semiconductor circuit design – a review [PDF]
Advances in Radio Science, 2009 Product development based on highly integrated semiconductor circuits faces various challenges. To ensure the function of circuits the electrical parameters of every device must be in a specific window.
C. Schlünder
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Enhance Reliability of Semiconductor Devices in Power Converters [PDF]
Electronics, 2020 As one of the most vulnerable components to temperature and temperature cycling conditions in power electronics converter systems in these application fields as wind power, electric vehicles, drive system, etc., power semiconductor devices draw great concern in terms of reliability.
Minh Hoang Nguyen, Sangshin Kwak
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Reliability Evaluation of Multi-Mechanism Failure for Semiconductor Devices Using Physics-of-Failure Technique and Maximum Entropy Principle [PDF]
IEEE Access, 2020 The physics-of-failure (PoF) technique is a practical approach to evaluate the reliability of semiconductor devices. However, the PoF approaches are usually insufficient in dealing with multi-mechanism failure and fitting the Monte Carlo (MC) sampling ...
Bo Wan, Ye Wang, Yutai Su, Guicui Fu
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Spline‐Based Drift Analysis for the Reliability of Semiconductor Devices [PDF]
Advanced Theory and Simulations, 2021 AbstractDesign and production of semiconductor devices for the automotive industry are characterized by high reliability requirements, such that the proper functioning of such devices is ensured over their whole lifetime. Manufacturers subject their products to extensive testing, such as high‐temperature operating life (HTOL) tests that simulate the ...
Vera Hofer +2 more
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Review of Power Semiconductor Device Reliability for Power Converters
CPSS Transactions on Power Electronics and Applications, 2017 The investigation shows that power semiconductor devices are the most fragile components of power electronic systems.Improving the reliability of power devices is the basis of a reliable power electronic system, and in recent years, many studies have focused on power device reliability.This paper describes the current state of the art in reliability ...
Xiong Du, Cai Jie, Luowei Zhou, Bo Wang
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2D Junction Profiling on Semiconductor Device Reliability Fail [PDF]
Microscopy and Microanalysis, 2017 Michael J. MacDonald +7 more
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Peanut Defect Identification Based on Multispectral Image and Deep Learning
Agronomy, 2023 To achieve the non-destructive detection of peanut defects, a multi-target identification method based on the multispectral system and improved Faster RCNN is proposed in this paper.
Yang Wang +8 more
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IEEE Journal of the Electron Devices Society, 2021 Barrier height ( $\phi _{b}$ ), trap state, bandgap ( $E_{g}$ ), and band alignment information of the metal–ZrO2–metal capacitor have been extracted using internal photoemission (IPE) system.
Tae Jin Yoo +7 more
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WBG-Based PEBB Module for High Reliability Power Converters
IEEE Access, 2021 The increasing presence of power electronic converters in the modern world – from electric vehicles, up to industrial applications – brings up concerns about their reliability, especially in the case of the Wide Band-Gap (WBG) devices ...
Sebastian Baba +3 more
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Sputtered 2D transition metal dichalcogenides: from growth to device applications [PDF]
Turk. J. Phys. (2021) 45, 131, 2021 Starting from graphene, 2D layered materials family has been recently set up more than 100 different materials with variety of different class of materials such as semiconductors, metals, semimetals, superconductors. Among these materials, 2D semiconductors have found especial importance in the state of the art device applications compared to that of ...
arxiv +1 more source