Results 21 to 30 of about 8,859 (159)

Vertically Oriented Single‐Layer Grains for a Highly Bifunctional Perovskite Photovoltaic Light‐Emitting Device

open access: yesRare Metals, Volume 45, Issue 3, March 2026.
ABSTRACT The realization of bifunctional perovskite devices integrating photovoltaic (PV) and light‐emitting diode (LED) capabilities requires precisely controlled grain architectures to facilitate dual carrier transport pathways. In this work, sulfaguanidine (SG) molecules were introduced into the perovskite solution to reconstruct the crystallization
Jiong Li   +7 more
wiley   +1 more source

Fabrication of Mechanically Controllable Break Junction Microchip and Simulation by Material Mechanics [PDF]

open access: yes, 2015
当“自下而上”途径组装器件的理念被提出后,美国科学家费曼继而提出小尺度上的操作和控制物质材料,这两个理念引导下产生的分子电子学成为备受人们关注的交叉性学科。过去的六十年里,分子电子学获得了飞速的发展,尤其是世纪之交的十年可谓是“分子电子学的黄金十年”,科学家们接连得到单原子、单分子尺度上的物理化学性质并付诸应用。然而,分子电子学研究的基本结构单元仍是金属/分子/金属结,而其构筑方法的不稳定性和表征手段不重现及单一性仍然是分子结的构筑和表征研究中面临的主要困境。 本论文工作以构筑稳定分子结为目标 ...
冯石
core  

Cu‐Enhanced Medium‐Entropy TiZrCoCrMo Alloys: Balancing Superior Antibacterial and Osteogenic Properties for Orthopedic Implants

open access: yesRare Metals, Volume 45, Issue 2, February 2026.
ABSTRACT This study introduces novel nonequiatomic TiZrCoCrMoCux (x = 0, 5, 10; at%) medium‐entropy alloys (MEAx) tailored for orthopedic implants, synergistically combining the biocompatibility of Ti‐based alloys, the wear resistance of CoCrMo alloys, and the antibacterial/osteogenic attributes of Cu. The alloy's microstructure, mechanical properties,
Hang Yu   +9 more
wiley   +1 more source

风电场35 kV集电线路用混合电阻片避雷器研究

open access: yesDianci bileiqi, 2021
风电场35 kV集电线路所用的线路避雷器由于其能量吸收能力有限,在雷电流幅值较大时其MOA电阻片存在热崩溃的可能,严重威胁着集电线路的安全运行,因此必须采取措施对其进行抑制。本研究以某风电场35 kV集电线路雷击过程为研究对象,并采用ATP-EMTP软件搭建暂态仿真模型,提出一种新的风电场集电线路用35 kV混合电阻片线路避雷器,该避雷器采用氧化锌电阻片与碳化硅电阻片相互交替组合的形式,充分利用氧化锌电阻片动作快、碳化硅电阻片通流容量大的特点,形成兼顾两种电阻片优点的新的避雷器 ...
刘守豹   +6 more
doaj  

Investigation of oxygen precipitates and the stability of denuded zone in Czochralski silicon [PDF]

open access: yes, 2016
铜在硅中不仅具有很大的扩散速率,而且随着温度的降低它的固溶度迅速下降,这两个特性使得铜原子很容易在器件制备过程中沉淀下来,严重影响硅片性能。虽然科研工作者们已经提出了多种工艺使硅片近表面处形成洁净区,但却很少对硅中的氧沉淀和洁净区的稳定性进行深入探讨。因此,本文通过实验分析了氧沉淀和洁净区的稳定性,得出以下结论: (1)研究了热处理方式和铜引入温度对洁净区的形成及其稳定性的影响。研究发现,只有Ramping-低-高热处理能使硅片内生成大量氧沉淀的同时有效形成洁净区。引入铜玷污后,RTP-低 ...
吕耀朝
core  

From Microstructure to Macroscopic Performance: A Comprehensive Study on Low‐K Oxide‐Doped BNT–LST–NN Ceramics for Energy Storage

open access: yesRare Metals, Volume 45, Issue 2, February 2026.
ABSTRACT Dielectric ceramics are popular for energy storage materials because of their rapid charge–discharge characteristics, whereas their low energy density and efficiency hinder their miniaturization and integration. In this work, the energy storage performance is significantly enhanced through introducing Al2O3 and TiO2 into the 0.425(Bi0.5Na0.5 ...
Qiansi Zhang   +9 more
wiley   +1 more source

海上风电35kV集电系统中性点不同接地方式下过电压分析

open access: yesDianci bileiqi, 2023
随着海上风电场规模的增加,35 kV集电系统的海缆截面和长度也不断增加,由于海上风电35 kV集电系统与陆上35 kV配电网中性点接地方式不同,但其海缆绝缘厚度与陆缆标准一致,导致其绝缘水平有较大裕度,造成一定资源的浪费。以某海上风场35 kV集电系统为例,搭建了3条集电线路仿真模型,计算了35 kV海缆在合闸/切除集电线路、合闸/切除箱式变压器等操作工况下和弧光接地下的过电压水平,比较海上风电集电系统中性点在不同接地方式下,不同工况下35 kV海缆在所承受的过电压水平的差异,结果标明:合闸 ...
黄涛   +6 more
doaj  

Investigation of oxygen precipitates and copper complex in Czochralski silicon [PDF]

open access: yes, 2015
用直拉法生长的单晶硅中,氧是最常见的杂质,硅材料制备过程使用的内吸杂工艺则是以氧沉淀及其诱生缺陷为基础。铜作为最常见的过渡族金属玷污之一,其沉淀及复合体将会较大程度地影响硅材料的性能。因此,研究氧沉淀和铜沉淀及其复合体在直拉硅单晶中的行为,除了具有重要的理论意义外,在实际生产中也可以提高硅器件的性能。本论文利用光学显微镜,傅立叶红外光谱仪及荧光光谱仪对不同热处理方式下硅中氧和铜的行为进行研究,得出的主要结论如下: (1)研究了线性升温(Ramping)的起始温度和升温速率对硅单晶中氧沉淀行为的影响 ...
谢婷婷
core  

Lithiophilic CoNiB Quantum Dots Embedded in N‐Doped Porous Carbon as Multifunctional Interlayer for Dendrite‐Free and Stable Lithium Metal Batteries

open access: yesRare Metals, Volume 45, Issue 1, January 2026.
ABSTRACT Lithium metal batteries (LMBs) promise ultrahigh energy density, yet their advancement is impeded by dendritic lithium growth and unstable interfacial behavior. Herein, for the first time, we present novel lithiophilic CoNiB quantum dots embedded in nitrogen‐doped hollow carbon nanorods (CoNiB@NC) as a multifunctional interlayer on a ...
Yu Wu   +8 more
wiley   +1 more source

Electrochemical Nanomachining based on Redox Hydrogel Nanofilm: Copper Planarization with nano-precision [PDF]

open access: yes, 2013
纳米加工要求能够在纳米或分子、原子水平上可控地实现材料的去除、形变或增添。材料去除是目前最常用的加工手段,其特征是将材料表面的一部分与本体之间的化学或金属键打开,并将之移离。按开键原理,相关的加工可大致分为机械、能量束(离子、激光、电子等)、电化学和化学等方法,并有着各自的优缺点,如:机械和能量束法加工精度高,但会造成加工面的损伤,电化学和化学方法则相反。 近年来,飞速发展的各应用领域对加工后的表面质量要求急剧提高,特别是超大规模集成电路制造中的铜互连导线以及高能激光应用中的发/反射镜面 ...
张红万
core  

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