Results 91 to 100 of about 224 (134)
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Cu pattern density impacts on 2.5D TSI warpage using experimental and FEM analysis

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014
Through Silicon Interposer (TSI) needs to fulfill multi-die stacking in one packaging which can bring high integration density, short interconnection length and small size for next generation devices. Die stacking is a key process in the TSI manufacturing flow, and within that process, die warpage is of central concern.
C. T. Yeh   +6 more
openaire   +1 more source

2.5D FEM Study and Optimization of Roll Pass Design in Roughing Mill Group

Materials Science Forum, 2011
The subject of the paper is a study of the material behaviour during hot rolling. The process considered is a rolling of round bar in roughing mill group which consist of four passes. The computer simulation of the process shows that the local plastic deformations which appear in the material are extremely large.
Sergey A. Aksenov   +3 more
openaire   +1 more source

Yacs - A New 2.5D FEM Eigenmode Solver for Axisymmetric RF-Structures

2015
Most feasibility studies for modern accelerator concepts, including superconducting multicell RF-cavity-resonators in circular accelerators, depend on computing a large number of eigenmode frequencies and field patterns to obtain typical figures of merit. This task includes computational intensive numerical studies.
Isbarn, Benjamin   +3 more
openaire   +1 more source

Ground Vibration Induced by Moving Train Loads on Unsaturated Ground Using 2.5D FEM

2020
Vibration of an unsaturated ground subjected to moving train loads is investigated using a two-and-a-half-dimensional finite element method (2.5D FEM). The track system is simplified as an Euler beam resting on the unsaturated porous medium, the governing equations are transformed to the frequency–wavenumber domain, and the results in time-space domain
G. Y. Gao, S. F. Yao, Qingsheng Chen
openaire   +1 more source

2.5D MFS–FEM model for the prediction of vibrations due to underground railway traffic

Engineering Structures, 2015
Abstract Vibrations induced by underground railway traffic have been receiving special attention from the technical and scientific communities, and different models for their prediction can be found in the literature. Since the tunnel can be seen as a longitudinally invariant structure, a 2.5D approach can be applied, minimizing the computational ...
Paulo Amado-Mendes   +3 more
openaire   +1 more source

Investigating ground vibration induced by moving train loads on unsaturated ground using 2.5D FEM

Soil Dynamics and Earthquake Engineering, 2019
Abstract A two-and-a-half-dimensional finite element method (2.5D FEM) is applied to investigate the dynamic response of an unsaturated ground subjected to moving loads caused by high-speed train. The partial differential equations of unsaturated porous medium in frequency domain are deduced based on the equations of motion and mass conservation of ...
Guangyun Gao   +3 more
openaire   +1 more source

Track–ground vibrations induced by railway traffic: In-situ measurements and validation of a 2.5D FEM-BEM model

Soil Dynamics and Earthquake Engineering, 2012
Abstract The first part of the paper includes a brief presentation of a 2.5 D FEM-BEM model, developed by the authors, which is able to lead with problems of vibrations induced by traffic including the train–track dynamic interaction. Then a global description of a test site developed on a stretch of the Portuguese railway network is presented.
P. Alves Costa   +2 more
openaire   +1 more source

Dynamic responses of unsaturated ground with or without embankment under moving loads using 2.5D FEM with perfectly match layer

Geomechanics and Geoengineering, 2021
The dynamic responses of an unsaturated ground with or without an embankment are analysed using 2.5D finite element method (FEM) to investigate the effects of the soil saturation and the embankment...
openaire   +1 more source

Finite Element Method (FEM) simulation based analysis for optimal chip layout of a 2.5D flip chip package

2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018
The current paper describes finite element method based simulations to assess assembly process and thermo-mechanical reliability related risks associated with 2.5D flip chip package and to develop guidelines for an optimal chip layout of a 2.5D package.
Manish Nayini   +2 more
openaire   +1 more source

Preliminary Analysis of the Interaction Between Tunnel and Soil by the 2.5D FEM-BEM Method

2017
In this paper, both the full space and the half space 2.5 dimensional finite element-boundary element model is established for modeling the coupled tunnel and soil. The tunnel wall is modeled by using finite element method and the soil is modeled by using boundary element method.
Qingsong Feng, Shiyue Liu, Xiaoyan Lei
openaire   +1 more source

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