Laser-Based Selective Removal of EMI Shielding Layers in System-in-Package (SiP) Modules. [PDF]
Micromachines (Basel)Le XB, Choi WY, Han K, Choa SH.
europepmc +1 more source
Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging. [PDF]
Materials (Basel), 2023 Cheng HC, Jhu WY.
europepmc +1 more source
Cross Wire Projection Welding of Aluminium Alloy Bars (FEM 2.5D Calculations)
Biuletyn Instytutu Spawalnictwa, 2017 openaire +2 more sources
Multiscale Uncertainty Quantification of Woven Composite Structures by Dual-Correlation Sampling for Stochastic Mechanical Behavior. [PDF]
Polymers (Basel)Yang G +5 more
europepmc +1 more source
A novel multi-thickness topology optimization method for balancing structural performance and manufacturability. [PDF]
Struct Multidiscipl OptimStankiewicz G, Dev C, Steinmann P.
europepmc +1 more source
Enhanced Robustness of a Bridge-Type Rf-Mems Switch for Enabling Applications in 5G and 6G Communications. [PDF]
Sensors (Basel), 2022 Casals-Terré J +6 more
europepmc +1 more source
napariTFM: An open-source tool for traction force microscopy and monolayer stress microscopy. [PDF]
PLoS Comput BiolRuppel A +3 more
europepmc +1 more source
Deciphering the interplay between biology and physics with a finite element method-implemented vertex organoid model: A tool for the mechanical analysis of cell behavior on a spherical organoid shell. [PDF]
PLoS Comput BiolLaussu J +11 more
europepmc +1 more source
Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review. [PDF]
Micromachines (Basel)Wang Y +6 more
europepmc +1 more source
Lightweight Potential of Anisotropic Plate Lattice Metamaterials. [PDF]
Materials (Basel)Maier M, Stangl C, Saage H, Huber O.
europepmc +1 more source