Two-Step Glass Molding Process for Forming Glass Edges with Obtuse Angles for Mobile Displays. [PDF]
Park J +5 more
europepmc +1 more source
Thermal Side-Channel Threats in Densely Integrated Microarchitectures: A Comprehensive Review for Cyber-Physical System Security. [PDF]
Benelhaouare AZ +4 more
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Laser-Based Selective Removal of EMI Shielding Layers in System-in-Package (SiP) Modules. [PDF]
Le XB, Choi WY, Han K, Choa SH.
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Spiral phyllotaxis in the moss Physcomitrium patens emerges from simple division rules of the apical cell. [PDF]
Cammarata J +8 more
europepmc +1 more source
Cross Wire Projection Welding of Aluminium Alloy Bars (FEM 2.5D Calculations)
openaire +2 more sources
Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging. [PDF]
Cheng HC, Jhu WY.
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Multiscale Uncertainty Quantification of Woven Composite Structures by Dual-Correlation Sampling for Stochastic Mechanical Behavior. [PDF]
Yang G +5 more
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A primer to traction force microscopy. [PDF]
Zancla A +4 more
europepmc +1 more source
Deciphering the interplay between biology and physics with a finite element method-implemented vertex organoid model: A tool for the mechanical analysis of cell behavior on a spherical organoid shell. [PDF]
Laussu J +11 more
europepmc +1 more source
A novel multi-thickness topology optimization method for balancing structural performance and manufacturability. [PDF]
Stankiewicz G, Dev C, Steinmann P.
europepmc +1 more source

