Results 41 to 50 of about 249 (153)
A Review of Multiscale Thermal Modeling in Heterogeneous 3-D ICs
IEEE AccessThermal behavior has become a first-order constraint in advanced 2.5D/three-dimensional integrated circuits (3D ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become ...
Baibhari Priya Barua +2 more
doaj +1 more source
Shock and Vibration, Volume 2026, Issue 1, 2026.To efficiently and precisely quantify how the frequency‐dependent dynamic characteristics of rail pads affect the fundamental excitation sources of subway ground vibration and wheel‐rail rolling noise, a vertical vehicle‐rail‐fastener coupled dynamic model is constructed via the hybrid spectral element method (SEM) and symplectic method (SM).
Yinling Dou +7 more
wiley +1 more source
Frontiers in Earth ScienceThe Extra-Deep Azimuthal Resistivity Measurements (EDARM) tool, as an emerging technology, can effectively identify geological interfaces within a range of several tens of meters around the borehole, providing geological structures for directional ...
Pan Zhang +4 more
doaj +1 more source
Methods in Ecology and Evolution, Volume 16, Issue 10, Page 2170-2194, October 2025.Abstract Computational fluid dynamics (CFD) has become an essential tool for studying fluid interactions in biological systems. While widely used in engineering, its application in the natural sciences, particularly in paleobiology, remains limited due to the challenges of meshing complex organic geometries.
Matheo López‐Pachón +1 more
wiley +1 more source
Soils and FoundationsBased on a two-and-half-dimensional finite element model (2.5D FEM), the layered ground vibration under combined seismic and high-speed train loads was investigated.
Wei Xie +3 more
doaj +1 more source
A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications
Advanced Science, Volume 12, Issue 36, September 25, 2025.Conventional PCB etching (multi‐step) and indirect transfer techniques fail to meet structural electronics’ demands for lightweight, miniaturized, and customized manufacturing. 3D‐printed conformal circuits enable direct integration of conductive traces into substrates or onto surfaces, achieving integrated structural‐functional fabrication.
Wang Qin +12 more
wiley +1 more source
MathematicsHigh-speed train operation may cause vibration near track facilities and propagate far through the ground, affecting people’s lives, work, and normal use of precision instruments in an urban environment.
Shaofeng Yao +6 more
doaj +1 more source
Computer Graphics Forum, Volume 44, Issue 3, June 2025.Abstract We introduce a fast and invertible approximation for fusion plasma simulation data represented as 2D planar meshes with connectivities approximating magnetic field lines along the toroidal dimension in deformed 3D toroidal spaces. Scientific variables (e.g., density and temperature) in these fusion data are interpolated following a complex ...
Congrong Ren +6 more
wiley +1 more source
GelLight: Illumination Design, Modeling, and Optimization for Camera‐Based Tactile Sensor
Advanced Intelligent Systems, Volume 7, Issue 5, May 2025.A systematic modeling and optimization method for camera‐based tactile sensor illumination is proposed, which significantly improves the tactile performance and achieves high geometry reconstruction accuracy. The performance is validated by intensive simulation and real‐world experiments.
Jieji Ren +7 more
wiley +1 more source