Results 221 to 230 of about 5,869,309 (254)

High‐Mobility and Reliability Ultra‐Thin‐Channel Oxide Semiconductor Field‐Effect Transistors for Chip‐Interconnect‐Embedded Logic and Ferroelectric Memory

open access: yesAdvanced Materials, Volume 38, Issue 52, 16 September 2026.
BEOL‐compatible bilayer heterojunction oxide channel dual‐mode, memory‐logic ferroelectric transistor is fabricated to address long‐standing challenges of mobility and threshold voltage trade‐off by suppressing interfacial defects. This approach not only advances oxide semiconductors toward reliable high‐performance BEOL transistors but also opens new ...
Chun‐Kuei Chen   +12 more
wiley   +1 more source

A Wireless, Passive Multimodal Wearable Sensor With Decoupled Sensing Capabilities

open access: yesAdvanced Materials, Volume 38, Issue 52, 16 September 2026.
A wireless passive multimodal electronic skin is presented for the simultaneous perception of pressure, humidity, and odor through a frequency‐divided LC resonator array. The decoupled sensing architecture suppresses cross‐interference and enables independent signal readout under superimposed stimuli while maintaining high stability.
Wenjiang Han   +8 more
wiley   +1 more source

Spike‐Type Band Alignment via in2Se3/CuI Charge‐Transport Engineering Enables 26% Efficient Lead‐Free RbSn0.5Ge0.5I3 Perovskite Solar Cells

open access: yesAdvanced Materials Interfaces, Volume 13, Issue 18, 22 September 2026.
A lead‐free and Cd‐free RbSn₀.5Ge₀.5I3 perovskite solar cell is optimized through In2Se3/CuI charge‐transport engineering using SCAPS‐1D. Spike‐type band alignment suppresses interfacial recombination, enhances charge extraction, and achieves a power conversion efficiency of 26.01%, providing an effective strategy for high‐performance and ...
Md. Al Amin   +5 more
wiley   +1 more source

Coating‐Free Nanoscratching for Liquid‐Crystal Alignment on PCB‐Compatible Millimeter‐Wave Reflective Unit Cells

open access: yesAdvanced Materials Technologies, Volume 11, Issue 18, 18 September 2026.
Direct nanoscratching with a 500 nm diamond lapping film creates groove‐guided liquid‐crystal alignment interfaces on PCB‐compatible Cu‐patterned RF substrates within minutes, eliminating polymer coating and high‐temperature baking. The coating‐free process enables optical/molecular alignment validation and voltage‐programmable 28 GHz reflection‐phase ...
Junseok Ma   +5 more
wiley   +1 more source

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