Results 231 to 240 of about 69,500 (287)

Influence of Germanium Substitution on Phase Stability and Electrochemical Performance of Niobium Silicide

open access: yesAdvanced Sustainable Systems, EarlyView.
Schematic representation of the alloy design process for the Nb‐Si‐Ge system, based on the liquidus projection and phase diagram of the Nb‐Si‐Ge system. The figure includes the as‐cast microstructure produced via arc melting, the electrochemical cell setup and electrode preparation through slurry coating, and the specific capacitance of each electrode ...
Snehal L. Kadam   +2 more
wiley   +1 more source

Piezoelectric Biomaterials for Bone Regeneration: Roadmap from Dipole to Osteogenesis

open access: yesAdvanced Science, EarlyView.
Piezoelectric biomaterials convert mechanical forces into electrical signals, offering novel strategies to restore and modulate bone microenvironments for tissue engineering. This review examines molecular dipole origins, spatial arrangements, and pseudo‐piezoelectric mechanisms and highlights dipole‐engineering techniques for osteogenesis regulation ...
Xiyao Ni   +7 more
wiley   +1 more source

Digital twins as self-models for intelligent structures. [PDF]

open access: yesSci Rep
Shen X, Wagg DJ, Tipuric M, Bonney MS.
europepmc   +1 more source

Inhibition of UBE2C Promotes Parkin‐Mediated K63‐Linked Ubiquitination of TOP2A to Induce Senescence and Increase Sensitivity of Doxorubicin in Breast Cancer

open access: yesAdvanced Science, EarlyView.
In the study, UBE2C was found to be significantly overexpressed in breast cancer and transcriptionally regulated by FOXM1. Inhibition of UBE2C suppressed proliferation, induced senescence, and sensitized breast cancer cells to doxorubicin. Mechanistically, UBE2C inhibition promoted Parkin‐mediated K63‐linked ubiquitination of TOP2A.
Yihui Yang   +12 more
wiley   +1 more source

A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications

open access: yesAdvanced Science, EarlyView.
Conventional PCB etching (multi‐step) and indirect transfer techniques fail to meet structural electronics’ demands for lightweight, miniaturized, and customized manufacturing. 3D‐printed conformal circuits enable direct integration of conductive traces into substrates or onto surfaces, achieving integrated structural‐functional fabrication.
Wang Qin   +12 more
wiley   +1 more source

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