Results 231 to 240 of about 69,500 (287)
Solution and precipitation based radical polymerization of renewable vinyl lactones in renewable solvents. [PDF]
Apostolidis D+3 more
europepmc +1 more source
Schematic representation of the alloy design process for the Nb‐Si‐Ge system, based on the liquidus projection and phase diagram of the Nb‐Si‐Ge system. The figure includes the as‐cast microstructure produced via arc melting, the electrochemical cell setup and electrode preparation through slurry coating, and the specific capacitance of each electrode ...
Snehal L. Kadam+2 more
wiley +1 more source
CGLCS-Net: Addressing Multi-Temporal and Multi-Angle Challenges in Remote Sensing Change Detection. [PDF]
Liu K, Xue H, Huang C, Huo J, Chen G.
europepmc +1 more source
Piezoelectric Biomaterials for Bone Regeneration: Roadmap from Dipole to Osteogenesis
Piezoelectric biomaterials convert mechanical forces into electrical signals, offering novel strategies to restore and modulate bone microenvironments for tissue engineering. This review examines molecular dipole origins, spatial arrangements, and pseudo‐piezoelectric mechanisms and highlights dipole‐engineering techniques for osteogenesis regulation ...
Xiyao Ni+7 more
wiley +1 more source
Digital twins as self-models for intelligent structures. [PDF]
Shen X, Wagg DJ, Tipuric M, Bonney MS.
europepmc +1 more source
In the study, UBE2C was found to be significantly overexpressed in breast cancer and transcriptionally regulated by FOXM1. Inhibition of UBE2C suppressed proliferation, induced senescence, and sensitized breast cancer cells to doxorubicin. Mechanistically, UBE2C inhibition promoted Parkin‐mediated K63‐linked ubiquitination of TOP2A.
Yihui Yang+12 more
wiley +1 more source
Effect of hardness matching of aero spline sub-materials on wear performance. [PDF]
He X+5 more
europepmc +1 more source
A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications
Conventional PCB etching (multi‐step) and indirect transfer techniques fail to meet structural electronics’ demands for lightweight, miniaturized, and customized manufacturing. 3D‐printed conformal circuits enable direct integration of conductive traces into substrates or onto surfaces, achieving integrated structural‐functional fabrication.
Wang Qin+12 more
wiley +1 more source
Review of Lightweight, High-Temperature Thermal Insulation Materials for Aerospace. [PDF]
Zhang Q, Huang H, Lei C, Liu Y, Li W.
europepmc +1 more source