Results 191 to 200 of about 164,543 (307)

Design, characterization, and application of a mixed metal oxide (Al₂O₃-La₂O₃-V₂O₅) nanocomposite in photocatalytic degradation of methylene blue: a multi-technique approach. [PDF]

RSC Adv
Al Mamun A, Ray SK, Rafi MOS, Shandhi SP, Bhuiyan RH, Chowdhury F, Muslim T.   +6 more
europepmc   +1 more source

Unveiling a Near‐Total Rear Passivation for High Performance of Ultra‐Thin ACIGS

Advanced Science, EarlyView.
Ultra‐thin solar cells of (Ag,Cu)(In,Ga)Se2 (ACIGS) suffer from rear interface recombination, limiting their performance. To tackle it, a full coverage plasma enhanced chemically vapor‐deposited 8 nm porous SiOx passivation layer was implemented and evaluated. It is shown that a combination of the near‐complete passivation from silica and the formation
Xavier L. Pinheiro, António J. N. Oliveira, André F. Violas, Kevin Oliveira, Paulo A. Fernandes, Marika Edoff, Pedro M. P. Salomé, Jennifer P. Teixeira   +7 more
wiley   +1 more source

Controllable Preparation and Enhancement Mechanism of Al₂O₃ Nanomaterial-Modified Ultrafine Cement Composite Grouting Materials. [PDF]

Nanomaterials (Basel)
Cheng X, Tian C, Wang Y, Zhao G, Liu G, Li Y, Meng X, Ni L.   +7 more
europepmc   +1 more source

Advances in Se Wide‐Bandgap Photovoltaics and TexSe1‐x SWIR Photodiodes

Advanced Science, EarlyView.
In this review, fundamental properties and current challenges in Se photovoltaics (PVs) for tandem and indoor PVs and TexSe1‐x alloys for short wave infrared photodiodes are discussed. A case is made for the practicality of elemental chalcogenide optoelectronics, and a pathway toward resolving the key challenges in these respective technologies is ...
Adam D. Alfieri, Deep Jariwala
wiley   +1 more source

Effect of Al₂O₃ and SiC Fillers on the Structure and Properties of UHMWPE-Based Composite Coatings Produced by Flame Spraying. [PDF]

Polymers (Basel)
Skakov M, Zhanimkhan P, Skakov D, Buitkenov D, Maulet M, Nabioldina A.   +5 more
europepmc   +1 more source

A Reconfigurable Memristive Spiking Neuron Enabling Advanced Neuromorphic Computing

Advanced Science, EarlyView.
Pek Jun Tiw and co‐workers develop a reconfigurable memristive neuron that can exhibit four spiking behaviors with freely tunable spike train parameters. The neuron supports multiplexed spike encoding of multiple pieces of information. It also supports advanced neural network strategies, such as neural heterogeneity and dynamic mode switching ...
Pek Jun Tiw, Yuqi Li, Zhongyuan Li, Qihang Ding, Yuzhe Wang, Jiarong Wang, Yuchao Yang   +6 more
wiley   +1 more source

Facile synthesis of well-dispersed catalytic Pt nanoparticles on hybrid single-walled carbon nanotube-Al₂O₃ supports. [PDF]

Nanoscale Adv
Inbaraj DJ, Kim M, An H, An C, Lee S, Wi JS, Oh MW, Lee S, Shin DW.   +8 more
europepmc   +1 more source

Electroforming‐Free, Self‐Rectifying Selector‐Only Memory With Diffusive Cu‐Ion Dynamics for Logic‐In‐Memory Computing

Advanced Science, EarlyView.
Electroforming‐free, self‐rectifying switching with polarity‐dependent threshold modulation is realized in selector‐only memory through Cu‐ion migration in a bilayer stacked dual functional materials. Ultrafast rupturing of Cu filament enables drift‐free operation with high stability.
Jae‐Kyeong Kim, Dae‐Seong Woo, Min‐Jong Han, Hong‐Gwang Seo, Gwang‐Ho Park, In‐Taek Woo, Jea‐Gun Park, Jinsub Park   +7 more
wiley   +1 more source

Iron-Based Catalysts on Tailored Alumina Supports for CO_x-Free Methane Decomposition to H₂ and Carbon. [PDF]

ChemistryOpen
Alturki HS, Alterary SS, Abahussain AAM, Osman AI, Bayazed MO, Ibrahim AA, Alarifi N, Almubaddel FS, Saeed AMM, Kumar R, Al-Fatesh AS.   +10 more
europepmc   +1 more source

Wafer‐Scale 3D Integration for High‐Density Multi‐Valued Neuromorphic Logic

Advanced Science, EarlyView.
Wafer‐scale 3D vertically integrated multi‐valued logic (MVL) circuits are realized by monolithically integrating a Te/IGZO heterojunction FET with an engineered Te pull‐up FET. Heterointerface‐mediated transport and optimized current matching enable stable ternary operation, while vertical stacking reduces circuit footprint and interconnect complexity,
Chang‐Hyeon Kim, Min Seok Kim, Joong Bum Rhim, Tae In Kim, Hyuck‐In Kwon, Ick‐Joon Park   +5 more
wiley   +1 more source