Results 101 to 110 of about 918,746 (358)
This article presents a comprehensive analysis of the intrinsic relationships and applicability of Hill48 yield criterion. The applicability and error evaluation conditions for Hill48 are established based on specific experimental data. A parameter calibration strategy for N‐value based on error minimization is proposed, and the predictive accuracy is ...
Jinxin Wang +9 more
wiley +1 more source
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García +3 more
wiley +1 more source
The modification effects of Al-RE (rare earth) and Al-5Ti-1B master alloys on the microstructure and mechanical properties of as-cast 5182 aluminum alloys were studied.
Shen Li, Guo Y. J., Shi Z. M.
doaj +1 more source
Freeze‐drying of layered silicate is the key to get coatings with superior gas barrier. Freeze‐drying of layered silicates modified with dodecylamine (DDA) is a highly effective technique for the preparation of barrier pigments that significantly mitigate the permeation of oxygen, water vapor, and hydrogen through polymer films containing these ...
Joshua Lommes +4 more
wiley +1 more source
The dual prevention mechanism provides a systematic solution to address the difficulty of achieving accurate identification and dynamic control of risks and hazards in the traditional mine safety management model, which overly relies on manual inspection
LIAO Guangdong
doaj +1 more source
Plasma electrolytic oxidation is combined with ultrasonic spray deposition of polycaprolactone (PCL) on WE43 magnesium alloy to improve adhesion, corrosion resistance, and cytocompatibility. The hybrid coating demonstrates significantly reduced hydrogen evolution and enhances mechanical bonding, offering a promising strategy for next‐generation ...
Seyed Masih Mousavizadeh +9 more
wiley +1 more source
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke +3 more
wiley +1 more source
By combining porous, solid, and carbon fiber‐reinforced thermoplastic polyurethane within a single 3D printed honeycomb structure, this current work achieved precise control over spatial stiffness while ensuring strong interlayer adhesion. The findings demonstrate enhanced energy absorption and densification strain, outperforming traditional uniform ...
Savvas Koltsakidis +2 more
wiley +1 more source

