Results 201 to 210 of about 252,049 (365)
Real‐Time, Label‐Free Monitoring of Cell Behavior on a Bioelectronic Scaffold
A bioelectronic nanofibrous scaffold is introduced that supports cell growth while enabling real‐time, label‐free monitoring of cellular behavior through impedance measurements. The system correlates electrical signals with cell viability and surface coverage, offering an integrated platform for studying dynamic biological processes and advancing next ...
Dana Cohen‐Gerassi +10 more
wiley +1 more source
Squeeze exhaust casting Al2O3 particles dispersed 6061 aluminum alloy composite materials.
Gaohui Wu +3 more
openalex +2 more sources
Fluoride‐Free Adhesives for Low Surface Energy Fluorinated Substrates
A universal, fluoride‐free adhesive achieves a record 4.91 MPa bond strength on PTFE by leveraging amine/amide dipole–dipole interactions, without fluorinated components. This sustainable strategy overcomes the environmental and performance limits of PFAS‐based adhesives, enabling robust, eco‐conscious bonding across diverse materials.
Siqi Zheng +7 more
wiley +1 more source
Fatigue Damage of Aluminum Alloy Overhead Line Conductors Initiated by Fretting. [PDF]
Nowak A, Strzępek P, Korczak P.
europepmc +1 more source
Study of High-Temperature Deformation Behavior of Al-4.5Mg-0.6Mn Aluminum Alloy
栩 刘
openalex +1 more source
Switchable Supramolecular Adhesive by Tuning Interfacial Bonding and Modulus
The supramolecular adhesive (HyDiP) shows reversible adhesion and recyclability. In the dehydrated state, it is dense, stiff (E ≈445 MPa), transparent, and provides strong bonding with adhesion strengths up to 4.65 MPa. In the hydrated state, it becomes porous, soft (E ≈0.11 MPa), and detaches easily, enabling sustainable high‐strength applications ...
Rumin Fu +10 more
wiley +1 more source
Microstructure Evolution and Constitutive Model of Spray-Formed 7055 Forging Aluminum Alloy. [PDF]
Deng Y +6 more
europepmc +1 more source
Surface Diffusion in SnTe‐PbTe Monolayer Lateral Heterostructures
The lateral heterostructures between 2D materials often suffer from the interdiffusion at the interfaces. Here, a surface diffusion mechanism is found to be dominating at the interfaces between semiconducting SnTe and PbTe monolayers. Atomically sharp interfaces can be achieved by suppressing this diffusion process. ABSTRACT The construction of complex
Jing‐Rong Ji +9 more
wiley +1 more source

