MOFs and COFs in Electronics: Bridging the Gap between Intrinsic Properties and Measured Performance
Metal‐organic frameworks (MOFs) and covalent organic frameworks (COFs) hold promise for advanced electronics. However, discrepancies in reported electrical conductivities highlight the importance of measurement methodologies. This review explores intrinsic charge transport mechanisms and extrinsic factors influencing performance, and critically ...
Jonas F. Pöhls, R. Thomas Weitz
wiley +1 more source
Robust Phase Association and Simultaneous Arrival Picking for Downhole Microseismic Data Using Constrained Dynamic Time Warping. [PDF]
Wang T, Li L, Wen S, Lv Y, Yu Z, He C.
europepmc +1 more source
Defects Dynamic in Photo‐Excited CeO2 and their Influence on CO2 Photoreduction
X‐ray photoelectron spectroscopy study under light excitation is presented to track the defect dynamic (Ce4+ to Ce3+) in CeO2. Surface enhanced Raman spectroscopy confirmed the key role of Ce3+ states in controlling charge and energy transfer across the CeO2‐dye molecule interface.
Rambabu Yalavarthi +3 more
wiley +1 more source
Dynamic antenna clustering along with low RF complexity digital beamforming. [PDF]
Haider U +4 more
europepmc +1 more source
A bespoke multilayer thin film configuration has been designed, which overcomes the material dependency of conventional isotope exchange Raman spectroscopy (IERS). This universal IERS methodology is efficient, non‐destructive and provides additional structural information and time resolution, which can be further extended to various isotopic elements ...
Zonghao Shen +7 more
wiley +1 more source
Quantitative Angle Measurement of the Inclined Surface Crack Based on Laser Ultrasonics. [PDF]
Li H, Zhang R, Pan Q, Wang P.
europepmc +1 more source
LabVIEW implementation of a neural network based solution to the angle of arrival estimation problem
Shinling S. Haralambous
openalex +1 more source
Device Integration Technology for Practical Flexible Electronics Systems
Flexible device integration technologies are essential for realizing practical flexible electronic systems. In this review paper, wiring and bonding techniques critical for the industrial‐scale manufacturing of wearable devices are emphasized based on flexible electronics.
Masahito Takakuwa +5 more
wiley +1 more source
Impact of slip distance between fingertips and ball on baseball pitching performance under different friction conditions. [PDF]
Yamaguchi T +5 more
europepmc +1 more source

