Results 161 to 170 of about 165,996,826 (275)
Binder‐free laser powder bed fusion of 8YSZ with a femtosecond laser is used to map process windows linking scan strategy, heat accumulation, and grain growth. Time‐resolved thermography and simulations reveal thermal regimes that enable continuous, vitrified, and fine‐grained 8YSZ surface layers without absorptive additives and demonstrate ...
Markus Kühn +5 more
wiley +1 more source
Satellite Constellation Optimization for Emitter Geolocalization Missions Based on Angle of Arrival Techniques. [PDF]
Asciolla M +4 more
europepmc +1 more source
A New Low Complexity Angle of Arrival Algorithm for 1D and 2D Direction Estimation in MIMO Smart Antenna Systems. [PDF]
Al-Sadoon MAG +6 more
europepmc +1 more source
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz +4 more
wiley +1 more source
Angle of Arrival for the Beam Detection Method of Spatially Distributed Sensor Array. [PDF]
Zhao S +6 more
europepmc +1 more source
Design of a Multistable Finger Prosthesis with Programmable Metamaterials
This research article shows the development of a multistable programmble metamaterial for the use as a finger prosthesis. The material was designed on different hierarchical levels where the influence of geometrical parameters and combination of mechanical elements was explored.
Franziska Wenz +5 more
wiley +1 more source
The angle of arrival estimation of frequency-hopping cooperative object based on software-defined radio. [PDF]
Rustamaji, Kliwati S, Widada W.
europepmc +1 more source
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji +3 more
wiley +1 more source
Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley +1 more source
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source

