Results 171 to 180 of about 1,436 (260)

The Evolution of Aerosol Jet Printing, A Review: Enhancing Material Versatility and Improvements for Next‐Generation Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Aerosol Jet Printing (AJP) has emerged as a versatile additive manufacturing technique for high‐resolution, conformal, and multi‐material printing. This review highlights advances in printable materials, substrate compatibility, post‐processing, characterization, and process innovations, while critically discussing current challenges and future ...
Chandrachur Chatterjee   +2 more
wiley   +1 more source

Coating‐Free Nanoscratching for Liquid‐Crystal Alignment on PCB‐Compatible Millimeter‐Wave Reflective Unit Cells

open access: yesAdvanced Materials Technologies, EarlyView.
Direct nanoscratching with a 500 nm diamond lapping film creates groove‐guided liquid‐crystal alignment interfaces on PCB‐compatible Cu‐patterned RF substrates within minutes, eliminating polymer coating and high‐temperature baking. The coating‐free process enables optical/molecular alignment validation and voltage‐programmable 28 GHz reflection‐phase ...
Junseok Ma   +5 more
wiley   +1 more source

Nature‐Derived Chitosan Biopolymer: A Promising Candidate for Sustainable Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
In the creation of environmentally friendly devices, nature‐derived chitosan biopolymer is a promising contender for sustainable electronic research. It can be utilized to create more ecologically friendly scalable gadgets and has a variety of uses in different active layers of electronics.
Joshua McDonald   +3 more
wiley   +1 more source

Printed SWCNT‐Based p–n Junction Thin‐Film Near‐Infrared Photoresistors Enabled by a Sustainable Furan‐Derived π‐Conjugated Polymer

open access: yesAdvanced Materials Technologies, EarlyView.
A sustainable polymer–carbon nanotube bilayer enables efficient near‐infrared photodetection in a simple lateral planar p–n junction thin‐film architecture. Thermal side‐chain cleavage enhances interfacial coupling, shifts the dominant photoresponse from 800 to 1000 nm, and substantially improves device performance.
Jenner H. L. Ngai   +3 more
wiley   +1 more source

Spacer‐Less Substrate‐Integrated Metasurface for Near‐Unity Terahertz Absorption

open access: yesAdvanced Optical Materials, EarlyView.
ABSTRACT Although conventional metal‐insulator‐metal (MIM) terahertz (THz) absorbers can provide near‐unity absorption, their multilayer stacks inevitably introduce additional thickness, mass, and residual stress, which limit their compatibility with THz thermal sensing platforms.
Zihao Zhao   +6 more
wiley   +1 more source

Self‐Powered Visible‐Blind Graphene/NiO/ZnO UV‐C Photodiodes

open access: yesAdvanced Optical Materials, EarlyView.
“A scalable architecture for self‐powered UV‐C photodiodes integrates defect‐engineered p‐NiO/n‐ZnO heterojunctions with highly UV‐C transparent graphene anodes. The type‐II band alignment combined with the built‐in electrical field enables robust zero‐bias charge separation.
Umut Kaya   +5 more
wiley   +1 more source

Home - About - Disclaimer - Privacy