Results 181 to 190 of about 234,185 (302)

Multimodal Wearable Biosensing Meets Multidomain AI: A Pathway to Decentralized Healthcare

open access: yesAdvanced Science, EarlyView.
Multimodal biosensing meets multidomain AI. Wearable biosensors capture complementary biochemical and physiological signals, while cross‐device, population‐aware learning aligns noisy, heterogeneous streams. This Review distills key sensing modalities, fusion and calibration strategies, and privacy‐preserving deployment pathways that transform ...
Chenshu Liu   +10 more
wiley   +1 more source

Current‐Driven Nonreciprocal Response of Nonequilibrium Skyrmions

open access: yesAdvanced Science, EarlyView.
A skyrmion holds great promise for spintronic applications owing to its intrinsic topological stability and high mobility under ultra‐low current excitation. Here, by means of in situ electron microscopy, we demonstrate a skyrmion diode effect and the associated current‐driven nonreciprocal skyrmion dynamics in a designed FeGe‐based microdevice.
Xiuzhen Yu   +10 more
wiley   +1 more source

Type‐II Dirac Fermions in Monolayer In2O: Interplay of Magnetotransport, Spin Hall Effect, and Superconductivity

open access: yesAdvanced Science, EarlyView.
First‐principles calculations reveal that monolayer In2O${\rm In}_2{\rm O}$ hosts type‐II Dirac fermions near the Fermi level, which split into Weyl points under spin‐orbit coupling. The material exhibits negative and giant magnetoresistance, a pronounced spin Hall effect, and phonon‐mediated superconductivity at 1.5 K, establishing it as a unique ...
Qing‐Bo Liu   +6 more
wiley   +1 more source

Ferroelectric Devices for In‐Memory and In‐Sensor Computing

open access: yesAdvanced Science, EarlyView.
Inspired by biological systems, in‐memory and in‐sensor computing overcome von Neumann bottlenecks. Ferroelectric devices can mimic synaptic functions and sense stimuli like light or force, therefore are ideal for these paradigms. This review introduces the ferroelectric devices applied for in‐memory and in‐sensor computing, covering their structures ...
Hong Fang   +5 more
wiley   +1 more source

Highly Robust Sn‐Based MAX Anodes Constructed via Ti6C Octahedral Outer Immobilization and A‐Layer Fe Inner Anchoring for Long‐Life Lithium‐Ion Batteries

open access: yesAdvanced Science, EarlyView.
How can Sn‐based anodes achieve high capacity and long‐life cycling? This work unlocks the potential anode structure by confining Sn in the A layer of MAX phase with Ti6C octahedra as outer immobilization and Fe as inner anchors. The introduction of Fe dramatically strengthens the Ti–Sn bond to enhance structural integrity, modulate interfacial ...
Yu‐ang Lei   +13 more
wiley   +1 more source

Covalent Bonds Reinforced Strength and Modulus of Heterocyclic Aramid Fiber by Interfacial Aminated‐MXene Nanosheets

open access: yesAdvanced Science, EarlyView.
We demonstrate the covalent bonds strategy to enhance the mechanical property of PBIA fiber by using interfacial MXene‐NH2 nanosheets. The MXene‐NH2 nanosheets with reactive amino sites that can serve as nucleating agents and chain anchors to enhance orientation, crystallinity and interchain interaction of PBIA fiber via strong interfacial amido ...
Boyuan Chen   +7 more
wiley   +1 more source

Mechanistic Design of Graphdiyne‐Based Multimodal Sensing Integrating Machine Learning and Photothermal Dynamics for Precision Recognition and On‐Demand Inactivation

open access: yesAdvanced Science, EarlyView.
A triple‐mode theranostic platform enables integrated electrochemical, colorimetric, and photothermal detection of bacterial infection. Glucose oxidation triggers H2O2 generation and TMB oxidation to oxTMB, producing color and thermal signals under 808 nm NIR irradiation.
Jing Xu   +8 more
wiley   +1 more source

Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation

open access: yesAdvanced Science, EarlyView.
Vertically aligned graphene microstrip pads (GMPs) break the traditional thermomechanical trade‐off in thermal interface materials. It simultaneously achieves an ultrahigh through‐plane thermal conductivity of 565.92 W m−1 K−1 and an ultralow compressive modulus below 115.16 kPa.
Xu Ran   +7 more
wiley   +1 more source

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