Results 201 to 210 of about 817,292 (281)

Geometry‐Encoded Soft Strain Sensing via Liquid‐Metal Transmission Lines

open access: yesAdvanced Science, EarlyView.
This study presents a liquid‐metal transmission‐line strain sensor that achieves intrinsic decoupling by encoding axial elongation into propagation delay. The time‐domain readout remains stable under complex off‐axis. This enables reliable, repeatable, real‐time elongation measurement in dynamic, multiaxial loading environments for wearable electronics,
Zhang Liu   +12 more
wiley   +1 more source

Wood Carbon Sponge/SiO2 Aerogel Composites with Anisotropic Broadband Microwave Absorption, Elastic Resilience, and Thermal Insulation

open access: yesAdvanced Science, EarlyView.
Anisotropic wood carbon sponge/SiO2 aerogel composites are constructed, revealing a robust direction‐dependent permittivity ordering (tangential > radial > axial). The radial direction delivers an ultra‐broadband effective absorption bandwidth of 11.6 GHz at only 4.95 mm, while the tangential direction offers superior compressibility and thermal ...
Shuo Sun   +7 more
wiley   +1 more source

Solution‐Shearing of Highly Smooth Ion‐Gel Thin Films: Facilitating the Deposition of Organic Semiconductors for Ion‐Gated Organic Field Effect Transistors

open access: yesAdvanced Electronic Materials, Volume 11, Issue 6, May 2025.
A straightforward method is introduced to produce ion‐gel films with very low surface roughness by employing a solution‐shearing coating process. These ion‐gel films permit the growth of crystalline thin films of various small molecule organic semiconductor molecules directly on top of the ion‐gel layer, thereby enabling “inverted” small molecule ...
Jonathan Perez Andrade   +10 more
wiley   +1 more source

A Full Physical Strategy for Electrical Contacts on Laser‐Induced Graphene (LIG) Electrodes

open access: yesAdvanced Electronic Materials, EarlyView.
A fully dry fabrication strategy combining PVD and dual‐laser processing enables direct integration of laser‐induced graphene with metallic current collectors. Ultralow Au‐LIG contact resistance is achieved without binders, adhesives, or chemical treatments, while preserving electrochemical performance.
Davide Arcoraci   +9 more
wiley   +1 more source

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