Results 81 to 90 of about 177,245 (312)
On the viscosity of argon as affected by temperature [PDF]
John William Strutt
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Direct Consolidation of Copper–Graphene Composite by Rotary Swaging
The applicability of the rotary swaging method for preparation of electroconductive copper–graphene composite by direct consolidation of powders is proven. The consolidated material features advantageous microstructure featuring fine grains and twins, with homogeneous distribution of graphene, primarily along the twin boundaries, which contribute to ...
Radim Kocich+2 more
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Das magnetische Verhalten von Luft, Argon und Helium in Beziehung zu Sauerstoff [PDF]
Paul Tänzler
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Phase diagrams of transition‐metal di‐pnictides have been efficiently and quickly explored by combinatorial deposition of transition‐metal films and subsequent antimonization enabling the study of compounds with volatile elements. In (Fe,Ni)Sb2 and the (Fe,Cr)Sb2 substitution series, phase separation has been evidenced between class‐A and B marcasites ...
Martin Kostka+8 more
wiley +1 more source
We demonstrate measurements of the absorption coefficient α ≈ 2.5 × 10−7 cm−1 in synthetic crystalline quartz at a wavelength of 1071 nm with a signal-to-noise ratio of 10/1 using the Time-resolved photothermal common-path interferometry (TPCI) scheme ...
Ksenia Vlasova+2 more
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Über die Druckwage und die Isothermen von Luft, Argon und Helium zwischen 0 und 200° [PDF]
L. Holborn, H. Schultze
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In this research, ZrC coatings are evaluated against various counterprobes at the microscale using novel super‐stiff atomic force microscopy cantilevers. The chemical composition of the coating is shown to be an important factor influencing coating hardness and Young's modulus, while surface roughness, counterprobe hardness, and surface energy are the ...
Piotr Jenczyk+4 more
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Additive manufacturing technologies like laser powder‐bed fusion offer great design freedom and individualization of products down to a batch size of one. However, parts fabricated with this technology suffer from poor quality. Acoustic assistance during the build process can minimize these drawbacks.
Oliver Maurer, Dirk Bähre
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Helium and argon. Part III. Experiments which show the inactivity of these elements [PDF]
William Ramsay, John Norman Collie
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This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
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